料號

LCMXO256C-3TN100I

IC FPGA 78 I/O 100TQFP

封裝
100-LQFP
庫存
1,713 件
供貨狀態
當前數量需確認。
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產品屬性

製造商 Lattice Semiconductor Corporation
產品分類 FPGA - 現場可程式化閘陣列
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package Tray
Product status Active
Series MachXO
Supplier Device Package 100-TQFP (14x14)
Voltage - Supply 1.71V ~ 3.465V
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料號 LCMXO256C-3TN100I
供貨狀態 列示庫存 1,713 pcs 當前數量需確認。
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LCMXO256C-3TN100I 詳細描述

Product Overview

The LCMXO256C-3TN100I is a MachXO field programmable gate array from Lattice Semiconductor Corporation. It is a surface-mount integrated circuit in a 100-LQFP package, with a 100-TQFP (14 mm by 14 mm) device package. The device provides 78 I/O pins, 256 logic elements or cells, and 32 logic array blocks or configurable logic blocks. Its supply voltage range is 1.71 V to 3.465 V, and its junction temperature operating range is -40°C to 100°C. This configuration supports embedded systems that require custom digital logic in a surface-mount package.

Key Features

  • MachXO FPGA architecture with 256 logic elements or cells
  • 32 logic array blocks or configurable logic blocks
  • 78 I/O pins
  • 100-LQFP surface-mount package (100-TQFP, 14 mm by 14 mm) device package
  • 1.71 V to 3.465 V supply voltage range
  • -40°C to 100°C junction temperature operating range

Applications

  • Embedded control subsystems that require custom digital logic functions
  • Board-level logic consolidation where several discrete logic functions are implemented in one programmable device
  • Programmable logic reconfiguration within systems using a surface-mount FPGA package

Design & Procurement Notes

When selecting the LCMXO256C-3TN100I, verify that the system power supply remains within the 1.71 V to 3.465 V range across all operating conditions. Confirm that the PCB land pattern, clearance, and thermal path are appropriate for the 100-LQFP package, 100-TQFP (14 mm by 14 mm) surface-mount device package and that the junction temperature will not exceed 100°C. Evaluate whether 78 I/O pins provide sufficient external connectivity for the planned signals, and check that 256 logic elements or cells and 32 logic array blocks or configurable logic blocks meet the required logic capacity. Because the device is a field programmable gate array, pin assignment and logic behavior should be validated during design entry and board bring-up.

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