料號

71V3577S85PFG

IC SRAM 4.5MBIT PARALLEL 100TQFP

產品分類
記憶體 IC
封裝
100-LQFP
庫存
4,501 件
供貨狀態
當前數量需確認。
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產品屬性

製造商 IDT, Integrated Device Technology Inc
產品分類 記憶體 IC
Access Time 8.5 ns
Clock Frequency 87 MHz
Memory Format SRAM
Memory Interface Parallel
Memory Organization 128K x 36
Memory Size 4.5Mbit
Memory Type Volatile
Mounting Type Surface Mount
Operating Temperature 0°C ~ 70°C (TA)
Package Bulk
Product status Active
Supplier Device Package 100-TQFP (14x14)
Technology SRAM - Synchronous, SDR
Voltage - Supply 3.135V ~ 3.465V
資料表 查看資料表PDF
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料號 71V3577S85PFG
供貨狀態 列示庫存 4,501 pcs 當前數量需確認。
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71V3577S85PFG 詳細描述

Product Overview

The 71V3577S85PFG from IDT, Integrated Device Technology Inc is a synchronous SDR SRAM device with 4.5 Mbit of volatile memory, organized as 128K x 36. It uses a parallel interface and is specified for operation at a clock frequency of 87 MHz, with an access time of 8.5 ns. The device operates from a 3.135 V to 3.465 V supply and is packaged in a surface-mount 100-LQFP package, with a 100-TQFP (14 x 14) footprint. The operating temperature range is 0°C to 70°C (TA), supporting board-level designs that require a synchronous SRAM device with a fixed parallel data organization.

Key Features

  • 4.5 Mbit volatile SRAM with 128K x 36 memory organization.
  • Synchronous SDR technology with an 87 MHz clock frequency.
  • Parallel memory interface and 8.5 ns access time.
  • 3.135 V to 3.465 V supply voltage range.
  • 100-LQFP surface-mount package with a 100-TQFP (14 x 14) footprint.
  • 0°C to 70°C (TA) operating temperature range.

Applications

  • Embedded controller systems that need local volatile working memory for temporary data and lookup tables.
  • Digital signal processing hardware that requires a parallel synchronous SRAM buffer between a processor and other system memory.
  • Communications equipment designs where a 36-bit memory organization supports data buffering in a board-level system.

Design & Procurement Notes

Designers should verify that the host controller can drive the parallel interface, match the 87 MHz synchronous timing, and manage the 128K x 36 address and data organization. The 3.135 V to 3.465 V supply window and 0°C to 70°C ambient range should be checked against the board power and thermal budget. The 100-TQFP (14 x 14) surface-mount package requires pad layout and routing for a 100-pin memory device, and the 8.5 ns access time should be considered when planning memory access timing in the memory subsystem. Procurement should consider the 100-LQFP package and 100-TQFP (14 x 14) footprint when planning PCB assembly.

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