71V3556S166PFG
IC SRAM 4.5MBIT PARALLEL 100TQFP
- 產品分類
- 記憶體 IC
- 封裝
- 100-LQFP
- 庫存
- 3,254 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | IDT, Integrated Device Technology Inc |
|---|---|
| 產品分類 | 記憶體 IC |
| Access Time | 3.5 ns |
| Clock Frequency | 166 MHz |
| Memory Format | SRAM |
| Memory Interface | Parallel |
| Memory Organization | 128K x 36 |
| Memory Size | 4.5Mbit |
| Memory Type | Volatile |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Package | Bulk |
| Product status | Active |
| Supplier Device Package | 100-TQFP (14x14) |
| Technology | SRAM - Synchronous, SDR (ZBT) |
| Voltage - Supply | 3.135V ~ 3.465V |
| 資料表 | 查看資料表PDF |
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71V3556S166PFG 的主要供貨及採購資訊。
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71V3556S166PFG 詳細描述
Product Overview
The 71V3556S166PFG from IDT, Integrated Device Technology Inc is a volatile SRAM memory integrated circuit with a 4.5Mbit capacity organized as 128K x 36. It uses a parallel interface and synchronous, single data rate ZBT technology, with a specified clock frequency of 166 MHz and an access time of 3.5 ns. The device operates from a 3.135 V to 3.465 V supply and is offered in a surface mount 100-TQFP package with a 14 mm by 14 mm body.
Key Features
- Volatile SRAM memory format with 4.5Mbit total capacity and 128K x 36 organization.
- Synchronous single data rate ZBT technology with a 166 MHz clock frequency.
- Parallel memory interface with a 3.5 ns access time.
- 3.135 V to 3.465 V supply voltage range.
- Operating temperature range of 0°C to 70°C (TA).
- Surface mount 100-TQFP package with 14 mm by 14 mm body dimensions.
Applications
- High-speed data buffering in network and communications equipment.
- Synchronous memory subsystem for embedded processors and digital signal processing platforms.
- Temporary storage for register files and lookup data in control systems.
Design & Procurement Notes
Designers should verify that the host logic or controller supports a parallel synchronous SRAM interface, 166 MHz timing, and 3.5 ns access characteristics. The 3.135 V to 3.465 V supply range requires regulated power rails and adequate decoupling for the 100-TQFP package. Because the memory is volatile, system designs should account for data retention only while powered. The 0°C to 70°C (TA) operating range and surface mount package should be considered during thermal and PCB layout planning, including signal integrity for the 128K x 36 parallel bus.
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