CY62137BV18LL-70BAI
IC SRAM 2MBIT PARALLEL 48FBGA
- 產品分類
- 記憶體 IC
- 封裝
- 48-TFBGA
- 庫存
- 6,174 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Cypress Semiconductor Corp |
|---|---|
| 產品分類 | 記憶體 IC |
| Access Time | 70 ns |
| Memory Format | SRAM |
| Memory Interface | Parallel |
| Memory Organization | 128K x 16 |
| Memory Size | 2Mbit |
| Memory Type | Volatile |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package | Bulk |
| Product status | Active |
| Series | MoBL2™ |
| Supplier Device Package | 48-FBGA (7x7) |
| Technology | SRAM - Asynchronous |
| Voltage - Supply | 1.75V ~ 1.95V |
| Write Cycle Time - Word, Page | 70ns |
| 資料表 | 查看資料表PDF |
採購概覽
CY62137BV18LL-70BAI 的主要供貨及採購資訊。
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CY62137BV18LL-70BAI 詳細描述
Product Overview
CY62137BV18LL-70BAI from Cypress Semiconductor Corp is a volatile SRAM memory IC organized as 128K x 16 for a total capacity of 2 Mbit. The device uses an asynchronous parallel interface and specifies a 70 ns access time and 70 ns write cycle time for word/page operations. It operates from a 1.75 V to 1.95 V supply and is rated for an ambient operating temperature range of -40°C to 85°C. The component uses a 48-FBGA (7x7) surface-mount package, with a 48-TFBGA package/case designation, for printed circuit board assembly.
Key Features
- 2 Mbit SRAM memory capacity with a 128K x 16 organization
- Asynchronous parallel memory interface
- 70 ns access time and 70 ns word/page write cycle time
- 1.75 V to 1.95 V supply voltage range
- -40°C to 85°C ambient operating temperature range
- 48-FBGA (7x7) surface-mount package
Applications
- Random-access volatile storage in embedded controller designs
- Data buffering for systems using parallel memory buses
- Temporary storage in measurement, control, or processing equipment
- Memory expansion in circuit boards requiring a 128K x 16 organization
Design & Procurement Notes
For selection, confirm that the system supply rail falls within 1.75 V to 1.95 V and that the controller can use an asynchronous parallel interface with 70 ns timing. The 128K x 16 organization should match the intended memory map and data width. Board design should account for the 48-FBGA (7x7) surface-mount footprint and the -40°C to 85°C ambient temperature range. When reviewing land patterns and assembly documentation, verify the package designation used for the device, including 48-TFBGA and 48-FBGA (7x7).
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