CY22313ZXC
PROCESSOR CLOCK GENERATOR
- 產品分類
- 特定應用時脈與時序 IC
- 封裝
- 24-TSSOP (0.173", 4.40mm Width)
- 庫存
- 3,391 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Cypress Semiconductor Corp |
|---|---|
| 產品分類 | 特定應用時脈與時序 IC |
| Differential - Input:Output | No/No |
| Frequency - Max | 393.216MHz |
| Main Purpose | Memory, RDRAM |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 70°C |
| Package | Tube |
| PLL | Yes |
| Product status | Obsolete |
| Ratio - Input:Output | 1:4 |
| Supplier Device Package | 24-TSSOP |
| Voltage - Supply | 3.15V ~ 3.6V |
| 資料表 | 查看資料表PDF |
採購概覽
CY22313ZXC 的主要供貨及採購資訊。
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CY22313ZXC 詳細描述
Product Overview
The CY22313ZXC from Cypress Semiconductor Corp is an application-specific clock/timing IC for Direct Rambus clock generation in memory and RDRAM systems.The device includes a PLL and provides a 1:4 input-to-output ratio, with a maximum output frequency of 393.216MHz. It operates from a 3.15V to 3.6V supply and is rated for 0°C to 70°C. The IC is supplied in a surface-mount 24-TSSOP package with a 4.40 mm body width.
Key Features
- PLL-based clock generation for memory and RDRAM use
- 1:4 input-to-output frequency ratio
- Maximum output frequency of 393.216MHz
- 3.15V to 3.6V supply voltage range
- 0°C to 70°C operating temperature range
- Differential input and output configuration is No/No
- Surface-mount 24-TSSOP package
Applications
- Generating clock signals for RDRAM-based memory channels
- Supporting timing alignment in Direct Rambus DRAM subsystems
- Providing PLL-derived clock signals for memory-oriented electronic assemblies
Design & Procurement Notes
When selecting the CY22313ZXC, confirm that the board uses a 3.15V to 3.6V supply and that the required timing can be met with a 1:4 input-to-output ratio and a maximum output frequency of 393.216MHz. Because the differential input and output configuration is No/No, verify that the clocking scheme matches this No/No configuration. Check the 0°C to 70°C operating temperature range against the expected environment. The surface-mount 24-TSSOP package requires footprint and assembly compatibility. Since the supplied product status is Obsolete, procurement planning should account for lifecycle risk and verify the exact manufacturer part number.
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