CY7C68013A-56LTXC
IC MCU USB PHERIPH FX2LP 56VQFN
- ПРОИЗВОДИТЕЛЬ
- Infineon Technologies
- КАТЕГОРИЯ ТОВАРА
- Микроконтроллеры специального назначения
- Корпус
- 56-VFQFN Exposed Pad
- Склад
- 3,834 шт.
- Наличие
- Текущее количество требует подтверждения.
Характеристики товара
| ПРОИЗВОДИТЕЛЬ | Infineon Technologies |
|---|---|
| КАТЕГОРИЯ ТОВАРА | Микроконтроллеры специального назначения |
| Applications | USB Microcontroller |
| Controller Series | CY7C680xx |
| Core Processor | 8051 |
| Interface | I2C, USB, USART |
| Mounting Type | Surface Mount |
| Number of I/O | 24 |
| Operating Temperature | 0°C ~ 70°C |
| Package | Tray |
| Product status | Active |
| Program Memory Type | ROMless |
| RAM Size | 16K x 8 |
| Series | EZ-USB FX2LP™ |
| Supplier Device Package | 56-QFN (8x8) |
| Voltage - Supply | 3V ~ 3.6V |
| Техническая документация | Открыть техническую документацию PDF |
Сводка по закупке
Основная информация о поставке и закупке для CY7C68013A-56LTXC.
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Подробное описание CY7C68013A-56LTXC
Product Overview
The CYUSB2014-BZXC from Infineon Technologies, originally developed by Cypress Semiconductor, is an EZ-USB™ FX2G2 high-speed USB 2.0 peripheral controller based on the architecture and software ecosystem originally associated with the EZ-USB FX3 family.
It combines a programmable 32-bit Arm926EJ-S processor, 512KB SRAM, USB 2.0 High-Speed controller and a programmable GPIF II parallel interface. The device provides a high-bandwidth bridge between USB and external components such as FPGAs, image sensors, ADCs and application processors.
Despite its architectural relationship to FX3, the CYUSB2014 is a USB 2.0 High-Speed device with a maximum USB rate of 480Mbit/s. It does not provide the 5Gbit/s SuperSpeed USB interface found in CYUSB301x FX3 devices.
Key Features
Manufacturer: Infineon Technologies / Cypress Semiconductor
Part number: CYUSB2014-BZXC
Current product family: EZ-USB™ FX2G2
Original architectural family: EZ-USB FX3-derived USB controller
Device type: Programmable high-speed USB peripheral controller
USB standard: USB 2.0 High Speed
Maximum USB data rate: 480Mbit/s
USB Full-Speed support: 12Mbit/s
USB OTG support: High-Speed USB On-The-Go host and peripheral operation
Physical endpoints: 32
Processor core: 32-bit Arm926EJ-S
Maximum processor frequency: 200MHz
Embedded SRAM: 512KB
Program storage: Firmware executes from internal SRAM
Firmware-loading options: USB, I²C EEPROM, SPI Flash or external processor, depending on system configuration
Parallel interface: GPIF™ II
GPIF II operating frequency: Up to 100MHz
Maximum GPIF II bus width: 32 bits
GPIF II functions: Programmable timing, state machines, control signals and DMA data paths
External connectivity:
I²C
I²S
SPI
UART
JTAG
GPIO
SPI master speed: Up to 33MHz
UART speed: Up to 4Mbit/s
DMA architecture: Multi-channel direct-memory-access engine
Clock support: 19.2MHz crystal or compatible external clock configuration
Core supply: Nominally 1.2V
Core-voltage range: Approximately 1.15V to 1.25V
I/O supply range: Approximately 1.8V to 3.3V, depending on the interface bank
Overall operating-voltage range: 1.7V to 3.6V across applicable supply domains
Operating-temperature range: 0°C to +70°C
Temperature grade: Commercial/consumer
Package: 121-ball TFBGA
Infineon package code: PG-TFBGA-121
Package dimensions: 10 × 10mm
Mounting type: Surface mount
Moisture-sensitivity level: MSL 3
Peak reflow temperature: 260°C
Packaging: Tray
Standard tray quantity: 840 pieces
Tape-and-reel version: CYUSB2014-BZXCT
Environmental status: Halogen-free and RoHS compliant
Product status: Active and preferred
CYUSB2014 Versus CYUSB3014
The model numbers are similar but their USB capabilities differ:
CYUSB2014: USB 2.0 High Speed, up to 480Mbit/s
CYUSB3014: USB 3.x Gen 1 SuperSpeed, up to 5Gbit/s, plus USB 2.0 compatibility
They should not be treated as automatically interchangeable. The host interface, PCB layout, firmware configuration, USB descriptors, power architecture and required data bandwidth must be reviewed.
Ordering-Code Notes
CYUSB2014: Arm9-based USB 2.0 controller with GPIF II
BZX: 121-ball TFBGA package designation
C: Commercial temperature range, 0°C to +70°C
No final T: Tray packaging
Final T: Tape-and-reel packaging, as in CYUSB2014-BZXCT
The industrial-temperature version uses the I temperature suffix and operates from −40°C to +85°C.
Applications
The CYUSB2014-BZXC is suitable for high-bandwidth USB 2.0 interfaces requiring programmable parallel data acquisition and protocol conversion, including:
Machine-vision cameras
Industrial imaging systems
Biometric scanners
Fingerprint and iris-recognition equipment
Vision-guided robotics
Medical imaging equipment
Portable ultrasound systems
USB data-acquisition equipment
Digital oscilloscopes and logic analyzers
Test and measurement instruments
FPGA-to-USB interfaces
High-speed ADC data capture
Video-capture equipment
Surveillance cameras
Printers and scanners
Industrial controllers
Data loggers
High-performance human-interface devices
Custom USB protocol bridges
Legacy FX3-platform designs requiring USB 2.0 only
Its GPIF II interface can be configured to communicate with FPGAs, image sensors, DSPs and application-specific parallel buses without requiring a fixed external protocol.
Quality & Sourcing
Antrex Electronics can supply original CYUSB2014-BZXC inventory in factory tray packaging. Available label photographs, date codes, lot information and traceability documents can be provided before shipment.
Our sourcing and quality-control services include:
Original and traceable Infineon/Cypress component supply
BOM sourcing and consolidated quotations
Global inventory searches for USB controllers and interface ICs
Factory-label, lot-code and date-code verification
High-magnification visual and marking inspection
X-ray inspection of internal construction and BGA solder balls
XRF, decapsulation, solderability and electrical testing through qualified third-party laboratories
MSL, dry-pack and humidity-indicator verification
International shipping and customized inspection documentation
Customers should confirm that the design requires USB 2.0 High Speed rather than USB SuperSpeed. They should also verify the GPIF II bus configuration, firmware boot method, package format and temperature grade before ordering. Firmware developed with the EZ-USB FX3 SDK may still require device-specific configuration for CYUSB2014.
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