型番

CY7C68013A-56LTXC

IC MCU USB PHERIPH FX2LP 56VQFN

メーカー
Infineon Technologies
パッケージ
56-VFQFN Exposed Pad
在庫
3,834 pcs
供給状況
現在の数量は確認が必要です。
RFQに含まれる内容: 価格 在庫確認 デートコード リードタイム
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製品属性

メーカー Infineon Technologies
製品カテゴリ 特定用途向けマイクロコントローラ
Applications USB Microcontroller
Controller Series CY7C680xx
Core Processor 8051
Interface I2C, USB, USART
Mounting Type Surface Mount
Number of I/O 24
Operating Temperature 0°C ~ 70°C
Package Tray
Product status Active
Program Memory Type ROMless
RAM Size 16K x 8
Series EZ-USB FX2LP™
Supplier Device Package 56-QFN (8x8)
Voltage - Supply 3V ~ 3.6V
データシート データシート PDF を表示
購買情報

調達概要

CY7C68013A-56LTXC の主要な供給・購買情報です。

価格・在庫を確認
型番 CY7C68013A-56LTXC
供給状況 掲載在庫 3,834 pcs 現在の数量は確認が必要です。
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CY7C68013A-56LTXC の詳細説明

Product Overview

The CYUSB2014-BZXC from Infineon Technologies, originally developed by Cypress Semiconductor, is an EZ-USB™ FX2G2 high-speed USB 2.0 peripheral controller based on the architecture and software ecosystem originally associated with the EZ-USB FX3 family.

It combines a programmable 32-bit Arm926EJ-S processor, 512KB SRAM, USB 2.0 High-Speed controller and a programmable GPIF II parallel interface. The device provides a high-bandwidth bridge between USB and external components such as FPGAs, image sensors, ADCs and application processors.

Despite its architectural relationship to FX3, the CYUSB2014 is a USB 2.0 High-Speed device with a maximum USB rate of 480Mbit/s. It does not provide the 5Gbit/s SuperSpeed USB interface found in CYUSB301x FX3 devices.

Key Features

  • Manufacturer: Infineon Technologies / Cypress Semiconductor

  • Part number: CYUSB2014-BZXC

  • Current product family: EZ-USB™ FX2G2

  • Original architectural family: EZ-USB FX3-derived USB controller

  • Device type: Programmable high-speed USB peripheral controller

  • USB standard: USB 2.0 High Speed

  • Maximum USB data rate: 480Mbit/s

  • USB Full-Speed support: 12Mbit/s

  • USB OTG support: High-Speed USB On-The-Go host and peripheral operation

  • Physical endpoints: 32

  • Processor core: 32-bit Arm926EJ-S

  • Maximum processor frequency: 200MHz

  • Embedded SRAM: 512KB

  • Program storage: Firmware executes from internal SRAM

  • Firmware-loading options: USB, I²C EEPROM, SPI Flash or external processor, depending on system configuration

  • Parallel interface: GPIF™ II

  • GPIF II operating frequency: Up to 100MHz

  • Maximum GPIF II bus width: 32 bits

  • GPIF II functions: Programmable timing, state machines, control signals and DMA data paths

  • External connectivity:

    • I²C

    • I²S

    • SPI

    • UART

    • JTAG

    • GPIO

  • SPI master speed: Up to 33MHz

  • UART speed: Up to 4Mbit/s

  • DMA architecture: Multi-channel direct-memory-access engine

  • Clock support: 19.2MHz crystal or compatible external clock configuration

  • Core supply: Nominally 1.2V

  • Core-voltage range: Approximately 1.15V to 1.25V

  • I/O supply range: Approximately 1.8V to 3.3V, depending on the interface bank

  • Overall operating-voltage range: 1.7V to 3.6V across applicable supply domains

  • Operating-temperature range: 0°C to +70°C

  • Temperature grade: Commercial/consumer

  • Package: 121-ball TFBGA

  • Infineon package code: PG-TFBGA-121

  • Package dimensions: 10 × 10mm

  • Mounting type: Surface mount

  • Moisture-sensitivity level: MSL 3

  • Peak reflow temperature: 260°C

  • Packaging: Tray

  • Standard tray quantity: 840 pieces

  • Tape-and-reel version: CYUSB2014-BZXCT

  • Environmental status: Halogen-free and RoHS compliant

  • Product status: Active and preferred

CYUSB2014 Versus CYUSB3014

The model numbers are similar but their USB capabilities differ:

  • CYUSB2014: USB 2.0 High Speed, up to 480Mbit/s

  • CYUSB3014: USB 3.x Gen 1 SuperSpeed, up to 5Gbit/s, plus USB 2.0 compatibility

They should not be treated as automatically interchangeable. The host interface, PCB layout, firmware configuration, USB descriptors, power architecture and required data bandwidth must be reviewed.

Ordering-Code Notes

  • CYUSB2014: Arm9-based USB 2.0 controller with GPIF II

  • BZX: 121-ball TFBGA package designation

  • C: Commercial temperature range, 0°C to +70°C

  • No final T: Tray packaging

  • Final T: Tape-and-reel packaging, as in CYUSB2014-BZXCT

The industrial-temperature version uses the I temperature suffix and operates from −40°C to +85°C.

Applications

The CYUSB2014-BZXC is suitable for high-bandwidth USB 2.0 interfaces requiring programmable parallel data acquisition and protocol conversion, including:

  • Machine-vision cameras

  • Industrial imaging systems

  • Biometric scanners

  • Fingerprint and iris-recognition equipment

  • Vision-guided robotics

  • Medical imaging equipment

  • Portable ultrasound systems

  • USB data-acquisition equipment

  • Digital oscilloscopes and logic analyzers

  • Test and measurement instruments

  • FPGA-to-USB interfaces

  • High-speed ADC data capture

  • Video-capture equipment

  • Surveillance cameras

  • Printers and scanners

  • Industrial controllers

  • Data loggers

  • High-performance human-interface devices

  • Custom USB protocol bridges

  • Legacy FX3-platform designs requiring USB 2.0 only

Its GPIF II interface can be configured to communicate with FPGAs, image sensors, DSPs and application-specific parallel buses without requiring a fixed external protocol.

Quality & Sourcing

Antrex Electronics can supply original CYUSB2014-BZXC inventory in factory tray packaging. Available label photographs, date codes, lot information and traceability documents can be provided before shipment.

Our sourcing and quality-control services include:

  • Original and traceable Infineon/Cypress component supply

  • BOM sourcing and consolidated quotations

  • Global inventory searches for USB controllers and interface ICs

  • Factory-label, lot-code and date-code verification

  • High-magnification visual and marking inspection

  • X-ray inspection of internal construction and BGA solder balls

  • XRF, decapsulation, solderability and electrical testing through qualified third-party laboratories

  • MSL, dry-pack and humidity-indicator verification

  • International shipping and customized inspection documentation

Customers should confirm that the design requires USB 2.0 High Speed rather than USB SuperSpeed. They should also verify the GPIF II bus configuration, firmware boot method, package format and temperature grade before ordering. Firmware developed with the EZ-USB FX3 SDK may still require device-specific configuration for CYUSB2014.


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