MPF5023CMMA0ESR2
POWER MANAGEMENT IC, PRE-PROG, 3
- Manufacturer
- NXP USA Inc.
- Product Category
- Specialized Power Management ICs (PMICs)
- Package
- 40-VFQFN Exposed Pad
- Stock
- 1,465 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | NXP USA Inc. |
|---|---|
| Product Category | Specialized Power Management ICs (PMICs) |
| Applications | High Performance i.MX 8, S32x Processor Based |
| Current - Supply | 200µA |
| Grade | Automotive |
| Min Qty | 2000 |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Package | Tape & Reel (TR) |
| Product status | Active |
| Qualification | AEC-Q100 |
| Supplier Device Package | 40-HVQFN (6x6) |
| Voltage - Supply | 2.5V ~ 5.5V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for MPF5023CMMA0ESR2.
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Detailed Description for MPF5023CMMA0ESR2
Product Overview
NXP USA Inc. MPF5023CMMA0ESR2 is an automotive-grade power management IC intended for high-performance i.MX 8 and S32x processor-based platforms. The device includes three buck regulators and is qualified to AEC-Q100. It uses a 40-HVQFN (6x6) package with an exposed pad and wettable flank terminals. The supply voltage range is 2.5V to 5.5V, the supply current is 200µA, and the operating temperature range is -40°C to 125°C (TA).
Key Features
- Automotive-grade power management IC qualified to AEC-Q100 for automotive use.
- Targets high-performance i.MX 8 and S32x processor-based platforms.
- Includes three buck regulators.
- Supply voltage range of 2.5V to 5.5V.
- Supply current of 200µA.
- Operating temperature range of -40°C to 125°C (TA).
- 40-VFQFN exposed pad package, designated 40-HVQFN (6x6).
- Surface-mount package with wettable flank terminals.
Applications
- High-performance i.MX 8 processor-based platforms.
- S32x processor-based platforms.
- Automotive electronic systems that specify AEC-Q100 qualified power management components.
Design & Procurement Notes
Design reviews should confirm that the system supply remains within 2.5V to 5.5V and that ambient or thermal design keeps the device within -40°C to 125°C (TA). The 200µA supply current can be included in low-power budgeting, while the 40-HVQFN (6x6) exposed pad package requires pad layout, soldering, and inspection planning for the wettable flank terminals. For platforms based on i.MX 8 or S32x processors, verify the device configuration and power tree against the board-level requirements before finalizing the bill of materials. Automotive-grade and AEC-Q100 qualification should be matched to the target system requirements.
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