PART NUMBER

MT47H64M16NF-25E:M

IC DRAM 1GBIT PARALLEL 84FBGA

Manufacturer
Micron Technology Inc.
Product Category
Memory ICs
Package
84-TFBGA
Stock
3,016 pcs
Availability
Current quantity subject to confirmation.
RFQ includes: Price Stock confirmation Date Code Lead Time
Product photos & testing support available on request.

Product Attributes

Manufacturer Micron Technology Inc.
Product Category Memory ICs
Access Time 400 ps
Clock Frequency 400 MHz
Memory Format DRAM
Memory Interface Parallel
Memory Organization 64M x 16
Memory Size 1Gbit
Memory Type Volatile
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TC)
Package Tray
Product status Active
Supplier Device Package 84-FBGA (8x12.5)
Technology SDRAM - DDR2
Voltage - Supply 1.7V ~ 1.9V
Write Cycle Time - Word, Page 15ns
Datasheet View Datasheet PDF
PURCHASING INFORMATION

Procurement Snapshot

Key supply and purchasing information for MT47H64M16NF-25E:M.

Check Price & Availability
Part Number MT47H64M16NF-25E:M
Availability 3,016 pcs listed Current quantity subject to confirmation.
Packaging & Condition Packaging confirmation available Manufacturer packaging, label and package condition can be reviewed on request.
Date Code & Lot Verification available Date code, lot and label details can be reviewed on request.
Inspection Support Inspection & testing support Visual review, X-ray or additional testing can be arranged.
Procurement Support Volume & shortage sourcing OEM, EMS, hard-to-find and long-term supply requirements supported.
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Detailed Description for MT47H64M16NF-25E:M

Product Overview

The MT47H64M16NF-25E:M from Micron Technology Inc. is a DDR2 SDRAM memory IC with a 1 Gbit capacity and a 64M x16 organization. It uses a parallel memory interface and operates with a 400 MHz clock frequency. The device is specified for a 1.7V to 1.9V supply voltage and a 0°C to 85°C operating temperature range, referenced to case temperature. It is packaged in an 84-FBGA (8x12.5) surface-mount package, with the package/case designation 84-TFBGA.

Key Features

  • 1 Gbit volatile DRAM memory capacity with a 64M x16 organization
  • DDR2 SDRAM technology with a parallel memory interface
  • 400 MHz clock frequency, 400 ps access time, and 15 ns word/page write cycle time
  • 1.7V to 1.9V supply voltage range
  • 0°C to 85°C operating temperature range, referenced to case temperature
  • Surface-mount 84-FBGA (8x12.5) package, with 84-TFBGA package/case designation

Applications

  • DDR2-based computing platforms that require a parallel volatile memory device
  • Embedded processor boards designed around DDR2 SDRAM memory interfaces
  • Networking equipment using 1 Gbit DDR2 memory with a 64M x16 organization
  • Consumer electronics systems that require 400 MHz DDR2 SDRAM

Design & Procurement Notes

Design considerations should focus on matching the device to a DDR2 memory controller that supports a parallel 16-bit organization, 400 MHz operation, and the specified 400 ps access time and 15 ns word/page write cycle time. The 1.7V to 1.9V supply range and 0°C to 85°C case temperature range should be checked against the system power and thermal environment. The 84-FBGA (8x12.5) surface-mount package requires a compatible footprint and assembly process, and the 84-TFBGA package/case designation should be reconciled with the selected land pattern and mechanical documentation.

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