SI5344D-D-GM

Product Overview

The SI5344D-D-GM from Skyworks Solutions Inc. is a surface-mount clock and timing IC for jitter attenuation and multiplexing. It contains one circuit with PLL functionality, a maximum frequency of 350 MHz, and a 5:4 input-to-output ratio. The device accepts LVCMOS, LVDS, LVPECL, and crystal inputs, while available output formats include CML, HCSL, LVCMOS, LVDS, and LVPECL. Differential input and differential output support are provided. The IC operates from a 1.71 V to 3.47 V supply and is rated for a -40°C to 85°C operating temperature range. It is packaged in a 44-VFQFN exposed-pad package, also identified as 44-QFN (7x7).

Key Features

• Contains one circuit with PLL functionality, a maximum frequency of 350 MHz, and a 5:4 input-to-output ratio.
• Accepts LVCMOS, LVDS, LVPECL, and crystal inputs, with differential input capability.
• Provides CML, HCSL, LVCMOS, LVDS, and LVPECL outputs, with differential output capability.
• Operates from a 1.71 V to 3.47 V supply across a -40°C to 85°C operating temperature range.
• Uses a surface-mount 44-VFQFN exposed-pad package, identified as 44-QFN (7x7).

Applications

• Board-level timing paths that require conversion among LVCMOS, LVDS, LVPECL, CML, or HCSL signal formats.
• Clock planning where a 5:4 input-to-output relationship is needed with operation up to 350 MHz.
• Jitter attenuation and multiplexing in designs using differential clock inputs and differential clock outputs.

Design & Procurement Notes

When selecting the SI5344D-D-GM, verify that the board's clock source can present one of the supported input types (LVCMOS, LVDS, LVPECL, or crystal), and that the downstream load can accept the chosen output type among CML, HCSL, LVCMOS, LVDS, or LVPECL. The 5:4 input-to-output ratio and 350 MHz maximum frequency should be checked against the required clock plan. Power supply design should remain within 1.71 V to 3.47 V, and thermal layout should account for operation from -40°C to 85°C. The exposed-pad 44-VFQFN package supports surface-mount assembly and requires pad, thermal, and differential routing considerations appropriate to 350 MHz clock interfaces.