MC13892CJVLR2

Product Overview

The MC13892CJVLR2 from NXP USA Inc. is a power management IC (PMIC) associated with I.MX35/51 applications. The device uses a 186-LFBGA package and a 186-PBGA (12x12) device package, with surface-mount mounting. The operating temperature range is -40°C to 85°C. Functional application areas include battery management, display LED driver, handheld or mobile devices, and power supply. These characteristics define the package format, environmental range, mounting style, and primary application contexts for the part.

Key Features

• Power management IC (PMIC) associated with I.MX35/51 applications.
• 186-LFBGA package designation with 186-PBGA (12x12) device package.
• Surface-mount mounting type for PCB assembly.
• Operating temperature range of -40°C to 85°C.
• Application areas include battery management, display LED driver, handheld or mobile devices, and power supply.

Applications

• Battery management subsystems.
• Display systems requiring LED driver functions.
• Handheld or mobile device platforms.
• Power supply functions in system designs.

Design & Procurement Notes

When selecting the MC13892CJVLR2, verify that the board layout, soldering process, and mechanical envelope are compatible with a 186-PBGA (12x12) surface-mount package. The -40°C to 85°C operating temperature range should be compared with the expected environmental conditions of the final product. Confirm that the target design requires battery management, display LED driver, handheld or mobile device power management, and power supply operation. For platforms associated with I.MX35/51 power management, review the system architecture to ensure the PMIC role fits the intended implementation. The 186-LFBGA package designation should also be checked against the preferred package naming used in the assembly documentation.