XX1000-BD-000V

Product Overview

The XX1000-BD-000V from MACOM Technology Solutions is a broadband GaAs pHEMT MMIC active frequency doubler supplied as a bare die. It accepts an RF input from 7.5GHz to 25GHz and generates a doubled-frequency output covering 15GHz to 50GHz.

The device combines a single-ended frequency doubler with a distributed output buffer amplifier. Its single-ended input eliminates the need for an external balun, while the typical +15dBm saturated output power allows it to directly drive fundamental mixers and other millimeter-wave frequency-conversion stages.

Key Features

• Manufacturer: MACOM Technology Solutions

• Part number: XX1000-BD-000V

• Device type: Active MMIC frequency doubler

• Semiconductor technology: GaAs pHEMT

• Frequency multiplication factor: ×2

• Input-frequency range: 7.5GHz to 25GHz

• Output-frequency range: 15GHz to 50GHz

• RF input-power range: −10dBm to +10dBm

• Typical saturated output power: +15dBm

• Typical output power at 0dBm input: +13dBm

• Typical harmonic gain: 13dB

• Typical fundamental rejection: 20dBc

• Typical input return loss: 12dB

• Typical output return loss: 12dB

• Drain voltage: 5V typical, 5.5V maximum operating specification

• Stage-one gate bias: −0.6V typical

• Stage-two gate bias: 0V typical; may be actively controlled

• Source voltage: −5V typical

• Typical total drain current: Approximately 210–220mA

• Typical source current: 50mA

• RF input structure: Single-ended; no external balun required

• Number of bond pads: Seven

• Backside metallization: Gold; used as RF, DC and thermal ground

• Approximate die dimensions: 1.62 × 1.56mm

• Die thickness: 110µm ±10µm

• Package type: Unpackaged bare die

• Shipment format: Vacuum-release gel packs

• ESD classification: Class 2

• Storage temperature: −65°C to +165°C

• Environmental compliance: RoHS-compliant

• Product status: Active

The bare die includes surface passivation, backside via holes and gold metallization. It supports conductive-epoxy or eutectic-solder die attachment.

Ordering-Code Notes

• XX1000: Broadband active-doubler family

• BD: Bare-die version

• 000V: Vacuum-release gel-pack delivery format

Therefore, XX1000-BD-000V is not a packaged surface-mount IC. Assembly requires appropriate die-attach, wire-bonding, bias sequencing, RF grounding and ESD-controlled handling processes.

Applications

The XX1000-BD-000V is designed for microwave and millimeter-wave frequency-generation and local-oscillator chains, including:

• Point-to-point microwave radio

• Millimeter-wave communication links

• Satellite communication equipment

• VSAT terminals

• LMDS equipment

• Microwave transceivers

• Frequency synthesizers

• Local-oscillator multiplier chains

• Fundamental mixer drivers

• Broadband test and measurement equipment

• Electronic warfare and radar subsystems

• Aerospace and defence RF modules

• Hybrid microwave integrated circuits

• Multi-chip RF modules

It is particularly suitable as a broadband LO doubler for driving MACOM receiver and mixer products, including compatible XR-series receiver devices.

Quality & Sourcing

Antrex Electronics can help source original XX1000-BD-000V bare-die inventory with available manufacturer labels, lot information, date codes and traceability documentation.

Our sourcing and quality services include:

• Original and traceable MACOM component supply

• BOM sourcing and consolidated RF-component quotations

• Global searches for bare-die and hard-to-find microwave products

• Gel-pack, label, lot-code and quantity verification

• High-magnification visual inspection

• Die-dimension, bond-pad and backside-metallization inspection

• XRF and material-composition analysis

• RF, DC and output-power testing through qualified specialist laboratories

• ESD-safe handling and protective shipment packaging

• International delivery and customized inspection documentation

MACOM states that production units receive 100% on-wafer RF, DC and output-power testing, together with 100% visual inspection to MIL-STD-883 Method 2010. Because this product is a bare GaAs die, customers should also confirm gel-pack condition, die orientation, die quantity, storage history and assembly capability before ordering.