XX1000-BD-000V
MMIC,DIE,DBL,IN=7.5-25G,OUT=15-5
- 製品カテゴリ
- その他のRF IC／モジュール
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- 在庫
- 691 pcs
- 供給状況
- 現在の数量は確認が必要です。
製品属性
| メーカー | MACOM Technology Solutions |
|---|---|
| 製品カテゴリ | その他のRF IC／モジュール |
| Frequency | 7.5GHz ~ 25GHz, 15GHz ~ 50GHz |
| Function | Doubler |
| Min Qty | 100 |
| Mounting Type | Surface Mount |
| Package | Bulk |
| Product status | Active |
| RF Type | VSAT |
| データシート | データシート PDF を表示 |
調達概要
XX1000-BD-000V の主要な供給・購買情報です。
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XX1000-BD-000V の詳細説明
Product Overview
The XX1000-BD-000V from MACOM Technology Solutions is a broadband GaAs pHEMT MMIC active frequency doubler supplied as a bare die. It accepts an RF input from 7.5GHz to 25GHz and generates a doubled-frequency output covering 15GHz to 50GHz.
The device combines a single-ended frequency doubler with a distributed output buffer amplifier. Its single-ended input eliminates the need for an external balun, while the typical +15dBm saturated output power allows it to directly drive fundamental mixers and other millimeter-wave frequency-conversion stages.
Key Features
Manufacturer: MACOM Technology Solutions
Part number: XX1000-BD-000V
Device type: Active MMIC frequency doubler
Semiconductor technology: GaAs pHEMT
Frequency multiplication factor: ×2
Input-frequency range: 7.5GHz to 25GHz
Output-frequency range: 15GHz to 50GHz
RF input-power range: −10dBm to +10dBm
Typical saturated output power: +15dBm
Typical output power at 0dBm input: +13dBm
Typical harmonic gain: 13dB
Typical fundamental rejection: 20dBc
Typical input return loss: 12dB
Typical output return loss: 12dB
Drain voltage: 5V typical, 5.5V maximum operating specification
Stage-one gate bias: −0.6V typical
Stage-two gate bias: 0V typical; may be actively controlled
Source voltage: −5V typical
Typical total drain current: Approximately 210–220mA
Typical source current: 50mA
RF input structure: Single-ended; no external balun required
Number of bond pads: Seven
Backside metallization: Gold; used as RF, DC and thermal ground
Approximate die dimensions: 1.62 × 1.56mm
Die thickness: 110µm ±10µm
Package type: Unpackaged bare die
Shipment format: Vacuum-release gel packs
ESD classification: Class 2
Storage temperature: −65°C to +165°C
Environmental compliance: RoHS-compliant
Product status: Active
The bare die includes surface passivation, backside via holes and gold metallization. It supports conductive-epoxy or eutectic-solder die attachment.
Ordering-Code Notes
XX1000: Broadband active-doubler family
BD: Bare-die version
000V: Vacuum-release gel-pack delivery format
Therefore, XX1000-BD-000V is not a packaged surface-mount IC. Assembly requires appropriate die-attach, wire-bonding, bias sequencing, RF grounding and ESD-controlled handling processes.
Applications
The XX1000-BD-000V is designed for microwave and millimeter-wave frequency-generation and local-oscillator chains, including:
Point-to-point microwave radio
Millimeter-wave communication links
Satellite communication equipment
VSAT terminals
LMDS equipment
Microwave transceivers
Frequency synthesizers
Local-oscillator multiplier chains
Fundamental mixer drivers
Broadband test and measurement equipment
Electronic warfare and radar subsystems
Aerospace and defence RF modules
Hybrid microwave integrated circuits
Multi-chip RF modules
It is particularly suitable as a broadband LO doubler for driving MACOM receiver and mixer products, including compatible XR-series receiver devices.
Quality & Sourcing
Antrex Electronics can help source original XX1000-BD-000V bare-die inventory with available manufacturer labels, lot information, date codes and traceability documentation.
Our sourcing and quality services include:
Original and traceable MACOM component supply
BOM sourcing and consolidated RF-component quotations
Global searches for bare-die and hard-to-find microwave products
Gel-pack, label, lot-code and quantity verification
High-magnification visual inspection
Die-dimension, bond-pad and backside-metallization inspection
XRF and material-composition analysis
RF, DC and output-power testing through qualified specialist laboratories
ESD-safe handling and protective shipment packaging
International delivery and customized inspection documentation
MACOM states that production units receive 100% on-wafer RF, DC and output-power testing, together with 100% visual inspection to MIL-STD-883 Method 2010. Because this product is a bare GaAs die, customers should also confirm gel-pack condition, die orientation, die quantity, storage history and assembly capability before ordering.
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