料號

W25Q64JVZEIQ TR

IC FLASH 64MBIT SPI/QUAD 8WSON

產品分類
記憶體 IC
封裝
8-WDFN Exposed Pad
庫存
5,469 件
供貨狀態
當前數量需確認。
詢價內容包括: 價格 庫存確認 生產批次 交期
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產品屬性

製造商 Winbond Electronics
產品分類 記憶體 IC
Clock Frequency 133 MHz
Memory Format Flash
Memory Interface SPI - Quad I/O
Memory Organization 8M x 8
Memory Size 64Mbit
Memory Type Non-Volatile
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C (TA)
Package Tape & Reel (TR),Cut Tape (CT)
Product status Active
Series SpiFlash®
Supplier Device Package 8-WSON (8x6)
Technology FLASH - NOR
Voltage - Supply 2.7V ~ 3.6V
Write Cycle Time - Word, Page 3ms
資料表 查看資料表PDF
採購資訊

採購概覽

W25Q64JVZEIQ TR 的主要供貨及採購資訊。

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料號 W25Q64JVZEIQ TR
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W25Q64JVZEIQ TR 詳細描述

Product Overview

The W25Q64JVZEIQ TR from Winbond Electronics is a SpiFlash® NOR flash memory integrated circuit with 64 Mbit of non-volatile storage organized as 8M x 8. It uses an SPI Quad I/O interface and supports a clock frequency of 133 MHz. The device operates from a 2.7 V to 3.6 V supply and is specified for an ambient temperature range of -40°C to 85°C. It uses an 8-WDFN exposed-pad package with an 8-WSON (8x6) package and surface-mount assembly.

Key Features

  • 64 Mbit NOR flash memory with an 8M x 8 organization.
  • SPI Quad I/O interface supporting a 133 MHz clock frequency.
  • 2.7 V to 3.6 V supply voltage range.
  • Operating temperature range of -40°C to 85°C (TA).
  • 8-WDFN exposed-pad package and 8-WSON (8x6) package for surface-mount assembly.
  • 3 ms word/page write cycle time.

Applications

  • Embedded systems that need non-volatile storage for firmware or program code.
  • Microcontroller platforms that use SPI Quad I/O NOR flash to retain configuration or parameter data.
  • Compact surface-mount designs where 64 Mbit of NOR flash is added to a 2.7 V to 3.6 V memory bus.

Design & Procurement Notes

When selecting this device, verify that the system power supply and host interface match the specified 2.7 V to 3.6 V supply and SPI Quad I/O signaling at 133 MHz. The 8-WDFN exposed-pad package with 8-WSON (8x6) dimensions requires a compatible surface-mount footprint and pad layout. The -40°C to 85°C ambient range should be checked against the expected operating environment. A 3 ms word/page write cycle time may affect firmware update or data-writing routines, so timing margins should be considered during software development.

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