SN65HVD75DGKR
IC TRANSCEIVER HALF 1/1 8VSSOP
- 產品分類
- 驅動器、接收器與收發器IC
- 封裝
- 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
- 庫存
- 4,388 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Texas Instruments |
|---|---|
| 產品分類 | 驅動器、接收器與收發器IC |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 125°C |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Active |
| Supplier Device Package | 8-VSSOP |
| Voltage - Supply | 3V ~ 3.6V |
| 資料表 | 查看資料表PDF |
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SN65HVD75DGKR 的主要供貨及採購資訊。
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SN65HVD75DGKR 詳細描述
Product Overview
The Texas Instruments SN65HVD75DGKR is a surface-mount 1/1 transceiver for half-duplex RS422 and RS485 serial communication. It operates from a 3 V to 3.6 V supply and supports a 20 Mbps data rate, with 80 mV receiver hysteresis. The device uses an 8-VSSOP package, corresponding to 8-TSSOP or 8-MSOP with 3.00 mm width, and is specified for operation from -40 °C to 125 °C.
Key Features
- Provides one driver and one receiver in a half-duplex transceiver configuration for RS422 and RS485 protocols.
- Supports a 20 Mbps data rate and includes 80 mV receiver hysteresis.
- Operates from a 3 V to 3.6 V supply over a -40 °C to 125 °C temperature range.
- Uses a surface-mount 8-VSSOP package, corresponding to 8-TSSOP, 8-MSOP, 0.118", 3.00 mm width.
Applications
- Half-duplex RS485 serial bus segments used for data exchange between modules.
- RS422 serial links used for data transfer between embedded modules.
- Serial communication interfaces operating from a 3 V to 3.6 V supply in embedded systems.
Design & Procurement Notes
Designers should confirm that the system supply is within 3 V to 3.6 V and that the PCB footprint matches the surface-mount 8-VSSOP (8-TSSOP, 8-MSOP, 0.118", 3.00 mm width) package. The 1/1 half-duplex architecture requires transmit and receive timing to be managed for RS422 or RS485 communication. The 20 Mbps data rate and 80 mV receiver hysteresis should be evaluated against the intended signal path and receiver conditions. The -40 °C to 125 °C operating range should be checked against the environmental limits of the final assembly. Procurement should confirm that the selected package footprint matches the 8-VSSOP (8-TSSOP, 8-MSOP, 0.118", 3.00 mm width) package.
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