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料號

MGM111A256V1

RF TXRX MODULE 802.15.4 CHIP SMD

製造商
Silicon Labs
產品分類
RF收發器
封裝
31-SMD Module
庫存
10 件
供貨狀態
當前數量需確認。
詢價內容包括: 價格 庫存確認 生產批次 交期
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產品屬性

製造商 Silicon Labs
產品分類 RF收發器
Antenna Type Integrated, Chip
Current - Receiving 9.8mA
Current - Transmitting 8.2mA
Data Rate 250kbps
Frequency 2.4GHz
Memory Size 256kB Flash, 32kB SRAM
Min Qty 1
Modulation DSSS, O-QPSK
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C
Package Strip
Power - Output 10dBm
Product status Discontinued at Digi-Key
Protocol Zigbee®
RF Family/Standard 802.15.4
Sensitivity -99dBm
Serial Interfaces I2C, I2S, SPI, UART
Series Mighty Gecko
Utilized IC / Part EFR32
Voltage - Supply 1.85V ~ 3.8V
資料表 查看資料表PDF
採購資訊

採購概覽

MGM111A256V1 的主要供貨及採購資訊。

查詢價格及供貨
料號 MGM111A256V1
供貨狀態 列示庫存 10 pcs 當前數量需確認。
包裝與狀況 可確認包裝資訊 可按要求核對原廠包裝、標籤及包裝狀況。
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測試支援
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MGM111A256V1 詳細描述

Product Overview

MGM111A256V1 is a mesh-networking wireless SoC or module from Silicon Labs. It supports protocol-stack integration for connected home, lighting and industrial mesh products. It is commonly selected for Zigbee, Thread, Matter-ready, smart-home, lighting and industrial wireless mesh nodes.

For design-in, continuation sourcing or repair work, engineers should review RF matching, antenna layout, interface timing, supply filtering and firmware compatibility. The selected orderable code should also be checked for package footprint, firmware or stack support, RF band, regulatory requirements and lifecycle status before approval.

Key Features

  • Manufacturer: Silicon Labs
  • Part Number: MGM111A256V1
  • Device Type: mesh-networking wireless SoC or module
  • Wireless / RF Technology: IEEE 802.15.4 / Zigbee / Thread, Bluetooth Low Energy
  • RF Band / Frequency Focus: 2.4 GHz ISM band
  • Architecture / Integration: EFR32 multiprotocol wireless SoC platform for mesh and low-power connectivity
  • System Design Value: supports protocol-stack integration for connected home, lighting and industrial mesh products
  • Host / Peripheral Interface Review: memory size, radio configuration, GPIO and serial interfaces should be matched to the firmware stack
  • Security / Firmware Review: secure boot, key storage and stack support should be reviewed for connected-product requirements
  • Package / Case: 31-SMD Module
  • PCB / Assembly Review: module form factor; confirm antenna option, host-board footprint, shielding, labeling and certification requirements
  • Application Fit: Zigbee, Thread, Matter-ready, smart-home, lighting and industrial wireless mesh nodes
  • Design Verification Notes: RF matching, antenna layout, interface timing, supply filtering and firmware compatibility

Applications

MGM111A256V1 is well suited for low-power mesh networking products such as smart-home nodes, Thread or Zigbee sensors, lighting controls, building automation devices and Matter-related wireless designs.

Protocol stack compatibility, channel plan, output power, antenna performance, memory option and regional requirements should be matched to the target product before production use.

Quality & Sourcing

Antrex Electronics can support MGM111A256V1 sourcing with stock availability checks, RFQ quotation, date code review, package confirmation and shipment arrangement. For faster quotation, buyers can provide target quantity, acceptable date code, packaging preference, target price, required wireless protocol, frequency band, firmware or module version, and end-application information.

For quality control, Antrex Electronics can help arrange product photos, label review, visual inspection and third-party testing support when required. OEMs, EMS providers, wireless module manufacturers, IoT device makers, repair centers and electronic component buyers are welcome to send BOM lists or hard-to-find RF transceiver requirements for sourcing assistance.

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