BR25G640FJ-3GE2
IC EEPROM 64KBIT SPI 20MHZ 8SOPJ
- 產品分類
- 記憶體 IC
- 封裝
- 8-SOIC (0.154", 3.90mm Width)
- 庫存
- 4,422 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Rohm Semiconductor |
|---|---|
| 產品分類 | 記憶體 IC |
| Clock Frequency | 20 MHz |
| Memory Format | EEPROM |
| Memory Interface | SPI |
| Memory Organization | 8K x 8 |
| Memory Size | 64Kbit |
| Memory Type | Non-Volatile |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Active |
| Supplier Device Package | 8-SOP-J |
| Technology | EEPROM |
| Voltage - Supply | 1.6V ~ 5.5V |
| Write Cycle Time - Word, Page | 5ms |
| 資料表 | 查看資料表PDF |
採購概覽
BR25G640FJ-3GE2 的主要供貨及採購資訊。
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BR25G640FJ-3GE2 詳細描述
Product Overview
The Rohm Semiconductor BR25G640FJ-3GE2 is a non-volatile EEPROM memory IC offering 64 Kbit of storage in an 8K x 8 organization. It communicates through an SPI interface at a 20 MHz clock frequency and supports a supply voltage range of 1.6 V to 5.5 V. The device uses an 8-SOP-J surface-mount package, with an 8-SOIC (0.154", 3.90mm Width) case, and is specified for operation from -40°C to 85°C (TA).
Key Features
- 64 Kbit non-volatile EEPROM memory with 8K x 8 organization.
- SPI interface supporting a 20 MHz clock frequency.
- 5 ms word/page write cycle time.
- 1.6 V to 5.5 V supply voltage range.
- Operating temperature range of -40°C to 85°C (TA).
- Surface-mount 8-SOP-J package, 8-SOIC (0.154", 3.90mm Width).
Applications
- Embedded systems that store configuration parameters or calibration data in non-volatile memory.
- Consumer electronics that retain user settings after power removal.
- SPI-connected memory in embedded control boards using 1.6 V to 5.5 V supply rails.
Design & Procurement Notes
Design considerations include matching the host microcontroller to the SPI interface and 20 MHz clock frequency, and allowing for the 5 ms word/page write cycle time during firmware updates. The 1.6 V to 5.5 V supply range and -40°C to 85°C (TA) operating range should be checked against the system power and thermal environment. For layout and assembly, the 8-SOP-J surface-mount package and 8-SOIC (0.154", 3.90mm Width) case define the required footprint and mounting approach.
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