BR24T128-WZ
IC EEPROM 128KBIT I2C DIP8K
- 產品分類
- 記憶體 IC
- 封裝
- 8-DIP (0.300", 7.62mm)
- 庫存
- 1,994 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Rohm Semiconductor |
|---|---|
| 產品分類 | 記憶體 IC |
| Clock Frequency | 400 kHz |
| Memory Format | EEPROM |
| Memory Interface | I2C |
| Memory Organization | 16K x 8 |
| Memory Size | 128Kbit |
| Memory Type | Non-Volatile |
| Mounting Type | Through Hole |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package | Tube |
| Product status | Active |
| Supplier Device Package | 8-DIPK |
| Technology | EEPROM |
| Voltage - Supply | 1.6V ~ 5.5V |
| Write Cycle Time - Word, Page | 5ms |
| 資料表 | 查看資料表PDF |
採購概覽
BR24T128-WZ 的主要供貨及採購資訊。
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BR24T128-WZ 詳細描述
Product Overview
The BR24T128-WZ from Rohm Semiconductor is an 8-DIPK EEPROM memory IC with a 128Kbit non-volatile array organized as 16K x 8. It communicates over an I2C interface at a clock frequency of 400 kHz and operates from a 1.6V to 5.5V supply. The device is mounted through hole in an 8-DIP (0.300", 7.62mm) package and is specified for an ambient operating temperature range of -40°C to 85°C (TA). A 5ms word or page write cycle time supports repeated updates of stored data in embedded designs that require persistent configuration, calibration, or identification information.
Key Features
- 128Kbit EEPROM memory organized as 16K x 8
- I2C serial interface with 400 kHz clock frequency
- Non-volatile memory type
- 1.6V to 5.5V supply voltage range
- Through-hole 8-DIP (0.300", 7.62mm) / 8-DIPK package
- Operating temperature range of -40°C to 85°C (TA)
- 5ms word/page write cycle time
Applications
- Embedded control boards that store configuration parameters and device settings
- Measurement and instrumentation assemblies that retain calibration values after power removal
- Through-hole prototyping designs using I2C serial EEPROM storage
Design & Procurement Notes
When selecting the BR24T128-WZ for a design, match the host controller to the I2C 400 kHz interface and verify that the system supply remains within 1.6V to 5.5V. The 16K x 8 organization and 128Kbit capacity define the addressable data structure, while the 5ms word/page write cycle should be considered in firmware timing and write sequencing. The through-hole 8-DIP (0.300", 7.62mm) / 8-DIPK package supports through-hole PCB insertion, and the -40°C to 85°C (TA) ambient range sets the board-level thermal envelope. For procurement, confirm that the 8-DIPK footprint matches the intended through-hole PCB assembly process.
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