料號

R5F56307DDFP#V0

IC MCU 32BIT 384KB FLASH 100LQFP

產品分類
微控制器 - MCU
封裝
100-LQFP
庫存
4,210 件
供貨狀態
當前數量需確認。
詢價內容包括: 價格 庫存確認 生產批次 交期
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產品屬性

製造商 Renesas Electronics Corporation
產品分類 微控制器 - MCU
Connectivity CANbus, EBI/EMI, I2C, LINbus, SCI, SPI, USB
Core Processor RX
Core Size 32-Bit Single-Core
Data Converters A/D 8x10b, 14x12b; D/A 1x10b
EEPROM Size 32K x 8
Mounting Type Surface Mount
Number of I/O 78
Operating Temperature -40°C ~ 85°C (TA)
Oscillator Type Internal
Package Bulk
Peripherals DMA, LVD, POR, PWM, WDT
Product status Active
Program Memory Size 384KB (384K x 8)
Program Memory Type Flash
RAM Size 64K x 8
Series RX600
Speed 100MHz
Supplier Device Package 100-LFQFP (14x14)
Voltage - Supply (Vcc/Vdd) 2.7V ~ 3.6V
資料表 查看資料表PDF
採購資訊

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R5F56307DDFP#V0 的主要供貨及採購資訊。

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料號 R5F56307DDFP#V0
供貨狀態 列示庫存 4,210 pcs 當前數量需確認。
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R5F56307DDFP#V0 詳細描述

Product Overview

The R5F56307DDFP#V0 from Renesas Electronics Corporation is an RX600-series 32-bit microcontroller IC in a 100-LFQFP (14x14) surface-mount package. It combines an RX core operating at 100MHz with 384KB (384K x 8) FLASH program memory, 64K x 8 RAM, and 32K x 8 EEPROM. The device provides 78 I/O and supports connectivity including CANbus, EBI/EMI, I2C, LINbus, SCI, SPI, and USB. On-chip peripherals include DMA, LVD, POR, PWM, and WDT, while data conversion resources include A/D 8x10b, 14x12b; D/A 1x10b. The internal oscillator and 2.7V ~ 3.6V supply range support embedded microcontroller designs operating from -40°C ~ 85°C (TA).

Key Features

  • 32-bit RX core with 100MHz operating speed
  • 384KB (384K x 8) FLASH program memory
  • 64K x 8 RAM and 32K x 8 EEPROM
  • 78 I/O in a 100-LFQFP (14x14) surface-mount package
  • Connectivity includes CANbus, EBI/EMI, I2C, LINbus, SCI, SPI, and USB
  • Peripherals include DMA, LVD, POR, PWM, and WDT
  • Data converters include A/D 8x10b, 14x12b; D/A 1x10b
  • Internal oscillator with 2.7V ~ 3.6V supply range

Applications

  • Embedded control systems that require 32-bit processing, FLASH program storage, and mixed-signal interfacing
  • Communication nodes or controller interfaces using CANbus, LINbus, USB, I2C, SPI, or SCI connectivity
  • Sensing and actuation subsystems that use ADC, DAC, PWM, DMA, and multiple I/O

Design & Procurement Notes

Designers selecting the R5F56307DDFP#V0 should verify that the board power rail remains within the 2.7V ~ 3.6V supply range and that the PCB land pattern supports the 100-LFQFP (14x14) surface-mount package. The 384KB FLASH, 64K x 8 RAM, and 32K x 8 EEPROM sizes should be mapped against firmware, data logging, and nonvolatile storage needs. The 78 I/O and available interfaces, including CANbus, EBI/EMI, I2C, LINbus, SCI, SPI, and USB, require pin allocation and signal routing planning. A/D 8x10b, 14x12b; D/A 1x10b resources should be evaluated for analog front-end scaling and channel requirements. DMA, LVD, POR, PWM, and WDT features can support data transfer, voltage monitoring, reset behavior, pulse-width control, and watchdog operation, while the internal oscillator and -40°C ~ 85°C (TA) range should be checked against system timing and ambient conditions.

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