料號

ISL83076EIBZA

IC TRANSCEIVER FULL 1/1 14SOIC

封裝
14-SOIC (0.154", 3.90mm Width)
庫存
3,310 件
供貨狀態
當前數量需確認。
詢價內容包括: 價格 庫存確認 生產批次 交期
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產品屬性

製造商 Renesas Electronics Corporation
產品分類 驅動器、接收器與收發器IC
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C
Package Tube
Product status Active
Voltage - Supply 3V ~ 3.6V
資料表 查看資料表PDF
採購資訊

採購概覽

ISL83076EIBZA 的主要供貨及採購資訊。

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料號 ISL83076EIBZA
供貨狀態 列示庫存 3,310 pcs 當前數量需確認。
包裝與狀況 可確認包裝資訊 可按要求核對原廠包裝、標籤及包裝狀況。
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ISL83076EIBZA 詳細描述

Product Overview

The ISL83076EIBZA from Renesas Electronics Corporation is a 1/1 transceiver for full-duplex serial communication using RS422 and RS485 protocols. It operates from a 3 V to 3.6 V supply and supports a 20 Mbps data rate. The device uses a 14-SOIC package and is specified for an operating temperature range of -40°C to 85°C. Receiver hysteresis is 15 mV.

Key Features

  • 1/1 driver and receiver configuration with full-duplex operation
  • RS422 and RS485 protocol support
  • 20 Mbps data rate
  • 15 mV receiver hysteresis
  • 3 V to 3.6 V supply voltage
  • 14-SOIC package
  • Operating temperature range of -40°C to 85°C

Applications

  • Serial data exchange between a host processor and a remote peripheral module
  • RS422/RS485 physical-layer interface for instrumentation and data-acquisition equipment
  • Full-duplex communication links in control equipment

Design & Procurement Notes

Board layout should account for the 14-SOIC package. The 1/1 driver/receiver configuration should be mapped to the system's transmit and receive signal paths. System power should be regulated to remain within the 3 V to 3.6 V supply range. When integrating the transceiver, verify that the required protocol, duplex mode, and data rate match the device's RS422/RS485, full-duplex, 20 Mbps characteristics. The 15 mV receiver hysteresis value should be considered when evaluating receiver input behavior. Thermal design should also account for the -40°C to 85°C operating temperature range. The 14-SOIC package should be checked against the available board area and assembly process.

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