S9S08EL16F1VTJR
IC MCU 8BIT 16KB FLASH 20TSSOP
- 製造商
- NXP USA Inc.
- 產品分類
- 微控制器 - MCU
- 封裝
- 20-TSSOP (0.173", 4.40mm Width)
- 庫存
- 5,000 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | NXP USA Inc. |
|---|---|
| 產品分類 | 微控制器 - MCU |
| Connectivity | I2C, LINbus, SCI, SPI |
| Core Processor | S08 |
| Core Size | 8-Bit |
| Data Converters | A/D 12x10b |
| EEPROM Size | 256 x 8 |
| Mounting Type | Surface Mount |
| Number of I/O | 16 |
| Operating Temperature | -40°C ~ 105°C (TA) |
| Oscillator Type | External |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Peripherals | LVD, POR, PWM, WDT |
| Product status | Active |
| Program Memory Size | 16KB (16K x 8) |
| Program Memory Type | Flash |
| RAM Size | 512 x 8 |
| Series | S08 |
| Speed | 40MHz |
| Supplier Device Package | 20-TSSOP |
| Voltage - Supply (Vcc/Vdd) | 2.7V ~ 5.5V |
| 資料表 | 查看資料表PDF |
採購概覽
S9S08EL16F1VTJR 的主要供貨及採購資訊。
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S9S08EL16F1VTJR 詳細描述
Product Overview
The S9S08EL16F1VTJR from NXP USA Inc. is an 8-bit microcontroller built around the S08 core and packaged in a 20-TSSOP surface-mount case. It provides 16KB (16K x 8) FLASH program memory, 512 x 8 RAM, and 256 x 8 EEPROM, with 16 I/O connections. The device operates from a 2.7V to 5.5V supply and supports a 40MHz speed using an external oscillator. Communication interfaces include I2C, LINbus, SCI, and SPI, while on-chip peripherals include PWM, WDT, POR, and LVD. Analog input capability is provided by 12 10-bit ADC channels, and the operating temperature range is -40°C to 105°C (TA).
Key Features
- 8-bit S08 core with a 40MHz speed.
- 20-TSSOP surface-mount package with 16 I/O connections.
- 16KB (16K x 8) FLASH program memory, 512 x 8 RAM, and 256 x 8 EEPROM.
- I2C, LINbus, SCI, and SPI serial communication interfaces.
- PWM, WDT, POR, and LVD peripherals.
- 12 10-bit analog-to-digital converter channels for sensor and signal acquisition.
- External oscillator architecture for system clocking.
- 2.7V to 5.5V supply range and -40°C to 105°C (TA) operating temperature range.
Applications
- Sensor data acquisition systems using 12 10-bit ADC channels.
- PWM-controlled load and actuator interfaces.
- Serial communication subsystems using I2C, LINbus, SCI, or SPI.
- Embedded controllers with FLASH program memory and EEPROM data storage.
Design & Procurement Notes
Design considerations include selecting an external oscillator compatible with the 40MHz speed, routing the 20-TSSOP package with appropriate pad and thermal considerations, and ensuring the 2.7V to 5.5V supply meets system requirements. The 16 I/O count and 12 ADC channels affect pin allocation and signal conditioning needs. Memory sizes of 16KB FLASH, 512 x 8 RAM, and 256 x 8 EEPROM should be checked against firmware and data storage requirements. The presence of I2C, LINbus, SCI, and SPI interfaces supports multi-protocol communication, while PWM, WDT, POR, and LVD should be mapped in the firmware architecture. The -40°C to 105°C (TA) range should be considered during enclosure and board thermal design.
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