MIMXRT106FCVL5B
IC MCU 32BIT 128KB ROM 196MAPBGA
- 製造商
- NXP USA Inc.
- 產品分類
- 微控制器 - MCU
- 封裝
- 196-LFBGA
- 庫存
- 3,869 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | NXP USA Inc. |
|---|---|
| 產品分類 | 微控制器 - MCU |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SAI, SPDIF, SPI, UART/USART, USB OTG |
| Core Processor | ARM® Cortex®-M7 |
| Core Size | 32-Bit Single-Core |
| Data Converters | A/D 20x12b |
| Mounting Type | Surface Mount |
| Number of I/O | 127 |
| Operating Temperature | -40°C ~ 105°C (TJ) |
| Oscillator Type | External, Internal |
| Package | Tray |
| Peripherals | Brown-out Detect/Reset, DMA, LCD, POR, PWM, WDT |
| Product status | Active |
| Program Memory Type | External Program Memory |
| RAM Size | 1M x 8 |
| Series | RT1060 |
| Speed | 528MHz |
| Supplier Device Package | 196-MAPBGA (10x10) |
| Voltage - Supply (Vcc/Vdd) | 3V ~ 3.6V |
| 資料表 | 查看資料表PDF |
採購概覽
MIMXRT106FCVL5B 的主要供貨及採購資訊。
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MIMXRT106FCVL5B 詳細描述
Product Overview
The MIMXRT106FCVL5B from NXP USA Inc. is a 32-bit microprocessor integrated circuit built around an ARM Cortex-M7 core and rated for 528 MHz operation. It uses a 196-MAPBGA (10x10) surface-mount package and includes 128 KB of ROM. The device is intended for embedded microprocessor applications where a compact BGA footprint, 32-bit processing, and a junction temperature range of -40°C to 105°C are relevant design constraints.
Key Features
- 32-bit microprocessor integrated circuit based on the ARM Cortex-M7 core
- 528 MHz operating speed
- 128 KB ROM
- 196-LFBGA package/case
- 196-MAPBGA (10x10) surface-mount package
- -40°C to 105°C (TJ) operating temperature range
Applications
- Embedded control systems requiring a 32-bit microprocessor core
- Compact embedded modules using a 196-MAPBGA surface-mount footprint
- Embedded equipment operating over a -40°C to 105°C junction temperature range
Design & Procurement Notes
The 196-MAPBGA (10x10) package and surface-mount mounting type should be matched to the PCB footprint and assembly process. The -40°C to 105°C (TJ) operating temperature range should be checked against board-level thermal conditions, since the rating is specified as junction temperature rather than ambient. The 128 KB ROM, 528 MHz ARM Cortex-M7 core, and RT1060 series designation should be evaluated against the required code-storage and processing characteristics of the design. Designers should also confirm that the 196-LFBGA package/case and 196-MAPBGA (10x10) package notation are compatible with the intended assembly documentation. Thermal and footprint constraints are therefore central to using this 32-bit microprocessor in compact embedded designs.
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