R1801K001A-TR
BUCK DC/DC CONVERTER FOR ENERGY
- 產品分類
- 專用電源管理IC（PMIC）
- 封裝
- 12-UFDFN Exposed Pad
- 庫存
- 4,915 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Nisshinbo Micro Devices Inc. |
|---|---|
| 產品分類 | 專用電源管理IC（PMIC） |
| Applications | Energy Harvesting |
| Current - Supply | 200nA |
| Min Qty | 1 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Active |
| Series | R1801K |
| Supplier Device Package | DFN(PL)2730-12 |
| Voltage - Supply | 2.3V ~ 5.5V |
| 資料表 | 查看資料表PDF |
採購概覽
R1801K001A-TR 的主要供貨及採購資訊。
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R1801K001A-TR 詳細描述
Product Overview
The Nisshinbo Micro Devices Inc. R1801K001A-TR is a buck DC/DC converter PMIC intended for energy harvesting applications. It uses a surface-mount 12-UFDFN Exposed Pad package, with a DFN(PL)2730-12 device package. The device is specified for a supply voltage range of 2.3V to 5.5V and a supply current of 200nA. Its operating temperature range is -40°C to 85°C at ambient temperature. The part is suitable for compact power management designs where low supply current and surface-mount assembly are relevant considerations.
Key Features
- Buck DC/DC converter PMIC for energy harvesting use
- Supply voltage range of 2.3V to 5.5V
- Supply current of 200nA
- Operating temperature range of -40°C to 85°C (TA)
- Surface-mount 12-UFDFN Exposed Pad package
- Device package DFN(PL)2730-12
Applications
- Energy harvesting systems
- Harvested-power supply regulation
- Compact power conversion in surface-mounted assemblies
Design & Procurement Notes
When selecting the R1801K001A-TR, confirm that the system supply voltage falls within the specified 2.3V to 5.5V range and that the 200nA supply current is compatible with the power budget of the harvested-energy source. The -40°C to 85°C (TA) operating temperature range should be checked against the expected ambient conditions of the final product. The 12-UFDFN Exposed Pad package requires a compatible surface-mount land pattern and assembly process, and the exposed pad should be considered during PCB layout and soldering planning. The DFN(PL)2730-12 package should be verified against the footprint, pad geometry, and thermal handling requirements in the board design before finalizing the schematic or layout.
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