55909-0774
Molex 55909-0774 SlimStack 70-position 0.4mm pitch board connector
產品屬性
| 製造商 | Molex |
|---|---|
| 產品分類 | 高速／模組化連接器 |
| Applications | Mobile Devices, Consumer Electronics, Embedded Systems |
| Connector Type | Mezzanine Board-to-Board Plug |
| Contact Material | Brass |
| Contact Plating | Gold Plated |
| Durability | 30 Mating Cycles |
| Mating Height | 1.50mm / 1.80mm |
| Mounting Type | Surface Mount Technology (SMT) |
| Number of Positions | 70 Circuits |
| Number of Rows | 2 Rows |
| Operating Temperature Range | -40°C to +105°C |
| Orientation | Vertical |
| Packaging | Embossed Tape on Reel |
| Pitch | 0.40mm |
| Product Type | Board-to-Board Connector |
| Rated current | 0.3A per Contact |
| Rated voltage | 50V AC/DC |
| Series | SlimStack 55909 Series |
| Termination Style | Surface Mount |
| 資料表 | 索取數據表 |
採購概覽
55909-0774 的主要供貨及採購資訊。
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55909-0774 詳細描述
Product Overview
55909-0774 is a Molex SlimStack™ board-to-board connector designed for high-density, compact electronic applications. This 70-position vertical SMT connector features a 0.40mm pitch, dual-row configuration, gold-plated contacts and low-profile mating design. With reliable electrical performance, space-saving construction and secure PCB retention, it is suitable for mobile devices, industrial equipment, embedded systems and high-density electronic assemblies.
Key Features
Manufacturer: Molex
Part Number: 55909-0774
Product Type: Board-to-Board Connector
Series: SlimStack™ 55909 Series
Connector Type: Board-to-Board Plug
Number of Circuits: 70 Positions
Number of Rows: 2 Rows
Pitch: 0.40mm
Orientation: Vertical
Mounting Type: Surface Mount Technology (SMT)
Contact Material: Brass
Contact Plating: Gold plating
Termination Plating: Gold plating
Mated Height: 1.50mm / 1.80mm
Mated Width: 3.40mm / 4.20mm
Current Rating: 0.3A per contact
Voltage Rating: 50V AC/DC
Durability: Up to 30 mating cycles
Operating Temperature Range: -40°C to +105°C
Features: Low-profile design, high-density connection and reliable signal transmission
Applications: Mobile devices, embedded systems, industrial electronics and communication equipment
Packaging: Embossed tape on reel
Ordering Note: Buyers should verify connector compatibility, PCB layout requirements and the latest Molex datasheet before production use.
Applications
55909-0774 is designed for compact electronic systems requiring high-density board-to-board interconnection and reliable signal transmission. Typical applications include smartphones, portable devices, industrial controllers, communication equipment, embedded systems, medical electronics and other space-constrained electronic products.
Quality & Sourcing
Antrex Electronics can support 55909-0774 sourcing with stock availability checks, RFQ quotation, package confirmation, date code review and shipment arrangement. For project-based purchasing, buyers can provide quantity, target price, required delivery date, packaging requirements and application details for faster quotation support.
For quality control, Antrex Electronics can help arrange product photos, label verification, visual inspection and third-party testing support when required. OEMs, industrial equipment manufacturers, repair centers and electronic component buyers are welcome to submit BOM lists or hard-to-find connector requirements for sourcing assistance.
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可按製造商、產品分類或採購需求繼續尋找合適料號。
