M2S090S-1FGG484I
IC SOC CORTEX-M3 166MHZ 484FBGA
- 產品分類
- 系統單晶片（SoC）
- 封裝
- 484-BGA
- 庫存
- 1,449 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Microsemi Corporation |
|---|---|
| 產品分類 | 系統單晶片（SoC） |
| Architecture | MCU, FPGA |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Core Processor | ARM® Cortex®-M3 |
| Flash Size | 512KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package | Tray |
| Peripherals | DDR, PCIe, SERDES |
| Primary Attributes | FPGA - 90K Logic Modules |
| Product status | Obsolete |
| RAM Size | 64kB |
| Series | SmartFusion®2 |
| Speed | 166MHz |
| Supplier Device Package | 484-FPBGA (23x23) |
| 資料表 | 查看資料表PDF |
採購概覽
M2S090S-1FGG484I 的主要供貨及採購資訊。
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M2S090S-1FGG484I 詳細描述
Product Overview
The M2S090S-1FGG484I from Microsemi Corporation is an ARM Cortex-M3 system-on-chip device that combines a microcontroller core with SmartFusion2 FPGA resources. The processor operates at 166 MHz and provides 512 KB of flash memory and 64 KB of RAM. The device uses a 484-FPBGA (23x23) package, and it supports operation over a junction temperature range of -40°C to 100°C.
Key Features
- ARM Cortex-M3 core with 166 MHz operating speed
- 512 KB flash memory and 64 KB RAM
- MCU and FPGA architecture with 90K logic modules
- Support for DDR, PCIe, and SERDES peripherals
- Connectivity options include CANbus, Ethernet, I2C, SPI, UART/USART, and USB
- 484-FPBGA (23x23) package
- Junction temperature range of -40°C to 100°C
Applications
- Embedded control systems that require a processor core and configurable logic in one device
- Control and communication equipment interfaces using Ethernet, USB, CANbus, or serial communication
- Data movement and memory subsystem designs using DDR, PCIe, or SERDES connectivity
- System integration where flash, RAM, and FPGA logic modules support mixed processing and logic functions
Design & Procurement Notes
For the M2S090S-1FGG484I, design teams can evaluate the device when a single package must contain both an ARM Cortex-M3 processor and SmartFusion2 FPGA resources. The 512 KB flash, 64 KB RAM, and 90K logic modules define the on-chip memory and programmable capacity for embedded software and hardware logic. The device interfaces, including DDR, PCIe, SERDES, CANbus, Ethernet, I2C, SPI, UART/USART, and USB, should be mapped against the required board-level connectivity. The 484-FPBGA (23x23) package and -40°C to 100°C junction temperature range are relevant to PCB layout and thermal design. Procurement planning should confirm that the selected part number matches the required package, speed, and temperature range before finalizing the schematic.
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