MIC2811-4GMSYML-TR
IC PWR MGMT DGTL TRPL LDO 16-MLF
- 產品分類
- 專用電源管理IC（PMIC）
- 封裝
- 16-VQFN Exposed Pad, 16-MLF®
- 庫存
- 1,494 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Microchip Technology |
|---|---|
| 產品分類 | 專用電源管理IC（PMIC） |
| Applications | Handheld/Mobile Devices |
| Min Qty | 5000 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 125°C |
| Package | Tape & Reel (TR) |
| Product status | Active |
| Supplier Device Package | 16-MLF® (4x4) |
| Voltage - Supply | 2.7V ~ 5.5V |
| 資料表 | 查看資料表PDF |
採購概覽
MIC2811-4GMSYML-TR 的主要供貨及採購資訊。
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MIC2811-4GMSYML-TR 詳細描述
Product Overview
The MIC2811-4GMSYML-TR from Microchip Technology is a power management integrated circuit (PMIC) for handheld and mobile devices. It provides a digital triple LDO function and operates from a supply voltage range of 2.7 V to 5.5 V. The device uses a surface-mount 16-VQFN exposed-pad package, with a 16-MLF (4x4) package designation, and supports an operating temperature range of -40°C to 125°C.
Key Features
- Microchip Technology power management IC for handheld and mobile devices.
- Digital triple LDO function for integrated power management.
- Supply voltage range of 2.7 V to 5.5 V.
- Operating temperature range of -40°C to 125°C.
- Surface-mount construction for PCB mounting.
- 16-VQFN exposed-pad package, with 16-MLF designation.
- 16-MLF (4x4) package designation.
- Specialized power management function for handheld and mobile devices.
- Power management integrated circuit (PMIC) for specialized applications.
- Exact manufacturer part number: MIC2811-4GMSYML-TR.
Applications
- Handheld devices using integrated power management.
- Mobile devices operating from a 2.7 V to 5.5 V supply.
- Portable electronic equipment using a 16-MLF surface-mount package.
Design & Procurement Notes
For design review, confirm that the system supply voltage is within 2.7 V to 5.5 V and that ambient or board-level conditions remain within -40°C to 125°C. The surface-mount 16-VQFN exposed-pad package, with 16-MLF (4x4) package designation, should be matched to the PCB land pattern and soldering process. Verify that the 16-MLF (4x4) package designation suits the available board area. For a digital triple LDO PMIC used in handheld and mobile applications, verify that the power architecture, board layout, and thermal pad handling align with the intended use case.
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