料號

M1A3P600L-FGG144

IC FPGA 177 I/O 144FBGA

封裝
144-LBGA
庫存
1,413 件
供貨狀態
當前數量需確認。
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產品屬性

製造商 Microchip Technology
產品分類 FPGA - 現場可程式化閘陣列
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package Tray
Product status Active
Series ProASIC3L
Supplier Device Package 144-FPBGA (13x13)
Voltage - Supply 1.14V ~ 1.575V
資料表 查看資料表PDF
採購資訊

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M1A3P600L-FGG144 的主要供貨及採購資訊。

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料號 M1A3P600L-FGG144
供貨狀態 列示庫存 1,413 pcs 當前數量需確認。
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M1A3P600L-FGG144 詳細描述

Product Overview

The M1A3P600L-FGG144 from Microchip Technology is a ProASIC3L field programmable gate array (FPGA) for embedded logic implementation in surface-mount designs. The device provides 600,000 gates, 177 I/O pins, and 110,592 total RAM bits within a 144-LBGA package, with a 144-FPBGA (13x13) package designation. Its supply voltage range is 1.14V to 1.575V, and its junction temperature operating range is 0°C to 85°C (TJ). The FPGA architecture supports configurable digital logic, routing, and on-chip memory resources for applications that require programmable control, data formatting, or interface bridging.

Key Features

  • ProASIC3L FPGA device with 600,000 gates and 177 I/O pins for configurable embedded logic.
  • Provides 110,592 total RAM bits for on-chip data storage and buffering.
  • Operates from a 1.14V to 1.575V supply voltage.
  • Surface-mount 144-LBGA package with a 144-FPBGA (13x13) package designation.
  • Specified junction temperature operating range of 0°C to 85°C (TJ).

Applications

  • Programmable control logic for embedded systems that require custom state machines or sequencing.
  • Interface bridging between digital buses and peripheral devices in configurable hardware designs.
  • On-chip data buffering or formatting using available RAM resources in embedded logic architectures.

Design & Procurement Notes

When selecting the M1A3P600L-FGG144, confirm that the PCB layout and assembly process support a surface-mount 144-LBGA package and the 144-FPBGA (13x13) device footprint. The 177 I/O count and 110,592 total RAM bits should be checked against the planned logic, routing, and on-chip memory needs. Power sequencing and supply margins must accommodate the 1.14V to 1.575V operating range, while thermal design should remain within the 0°C to 85°C junction temperature range. Because the part is a programmable gate array, design effort should account for logic synthesis, timing closure, and I/O assignment before finalizing the board layout.

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