M1A3P600L-FGG144
IC FPGA 177 I/O 144FBGA
- 產品分類
- FPGA - 現場可程式化閘陣列
- 封裝
- 144-LBGA
- 庫存
- 1,413 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Microchip Technology |
|---|---|
| 產品分類 | FPGA - 現場可程式化閘陣列 |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package | Tray |
| Product status | Active |
| Series | ProASIC3L |
| Supplier Device Package | 144-FPBGA (13x13) |
| Voltage - Supply | 1.14V ~ 1.575V |
| 資料表 | 查看資料表PDF |
採購概覽
M1A3P600L-FGG144 的主要供貨及採購資訊。
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M1A3P600L-FGG144 詳細描述
Product Overview
The M1A3P600L-FGG144 from Microchip Technology is a ProASIC3L field programmable gate array (FPGA) for embedded logic implementation in surface-mount designs. The device provides 600,000 gates, 177 I/O pins, and 110,592 total RAM bits within a 144-LBGA package, with a 144-FPBGA (13x13) package designation. Its supply voltage range is 1.14V to 1.575V, and its junction temperature operating range is 0°C to 85°C (TJ). The FPGA architecture supports configurable digital logic, routing, and on-chip memory resources for applications that require programmable control, data formatting, or interface bridging.
Key Features
- ProASIC3L FPGA device with 600,000 gates and 177 I/O pins for configurable embedded logic.
- Provides 110,592 total RAM bits for on-chip data storage and buffering.
- Operates from a 1.14V to 1.575V supply voltage.
- Surface-mount 144-LBGA package with a 144-FPBGA (13x13) package designation.
- Specified junction temperature operating range of 0°C to 85°C (TJ).
Applications
- Programmable control logic for embedded systems that require custom state machines or sequencing.
- Interface bridging between digital buses and peripheral devices in configurable hardware designs.
- On-chip data buffering or formatting using available RAM resources in embedded logic architectures.
Design & Procurement Notes
When selecting the M1A3P600L-FGG144, confirm that the PCB layout and assembly process support a surface-mount 144-LBGA package and the 144-FPBGA (13x13) device footprint. The 177 I/O count and 110,592 total RAM bits should be checked against the planned logic, routing, and on-chip memory needs. Power sequencing and supply margins must accommodate the 1.14V to 1.575V operating range, while thermal design should remain within the 0°C to 85°C junction temperature range. Because the part is a programmable gate array, design effort should account for logic synthesis, timing closure, and I/O assignment before finalizing the board layout.
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