LX5602LQ-TR
WIRELESS LAN FRONT-END MODULE
- 產品分類
- RF 前端 (LNA + PA)
- 封裝
- -
- 庫存
- 432 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Microchip Technology |
|---|---|
| 產品分類 | RF 前端 (LNA + PA) |
| Min Qty | 0 |
| Package | Tape & Reel (TR) |
| Product status | Obsolete |
| 資料表 | 索取數據表 |
採購概覽
LX5602LQ-TR 的主要供貨及採購資訊。
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LX5602LQ-TR 詳細描述
Product Overview
LX5602LQ-TR from Microchip Technology is a Wi-Fi RF front-end module used in RF front-end designs that need integrated transmit, receive, switching or low-noise signal-chain functions. This description focuses on practical RF parameters such as band coverage, PA/LNA path behavior, control requirements and package compatibility.
The exact orderable suffix should be matched before purchase because RF front-end devices often vary by band plan, pinout, reel format, qualification grade and control-state truth table.
Key Features
- Manufacturer: Microchip Technology
- Part Number: LX5602LQ-TR
- Device Type: Wi-Fi RF front-end module
- RF Band / Frequency Range: 2.4 GHz or 5 GHz WLAN band depending on LX5584/LX5586/LX5589/LX5602 suffix
- Transmit / PA Path: Integrated linear PA with power detector/coupler support on selected FEM variants
- Receive / LNA Path: Integrated LNA with bypass and SPDT/SP3T antenna switch functions depending on part family
- Output Power / Linearity: 802.11 WLAN output-power/EVM performance is suffix-specific; LX5586-class data sheets define 5 GHz FEM operation for 802.11ac systems
- Control / Bias: CMOS/logic control pins for TX/RX/bypass switch states; exact truth table depends on family
- System Impedance: 50 Ω RF interface where specified by the device reference design or data sheet
- Package / Case: Small QFN/LGA RF module package such as 2.5 mm to 3 mm class package depending on suffix
- Operating Temperature: RF front-end module temperature range is suffix-specific; verify industrial or automotive grade before sourcing
- Design Notes: Confirm LX5584/LX5586/LX5589/LX5602 band, pinout and harmonic-filter implementation before replacement.
Applications
WLAN client devices, access points, tablets, notebooks, gaming products and embedded Wi-Fi modules.
Also suitable for engineering replacements, shortage support and BOM consolidation where the same RF band, package footprint and control interface must be maintained.
Quality & Sourcing
Antrex Electronics can support sourcing for LX5602LQ-TR through available stock checks, BOM consolidation and alternative-lot review. For RF front-end modules, packaging condition, date code, MSL handling, reel labeling and moisture exposure should be checked before shipment.
For project builds, repair support or shortage coverage, Antrex Electronics can coordinate visual inspection, package verification and third-party testing when required. This helps buyers reduce risk when sourcing hard-to-find or lifecycle-sensitive RF front-end components.
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