LAN8720A-CP-ABC
IC TRANSCEIVER FULL 2/2 24SQFN
- 產品分類
- 驅動器、接收器與收發器IC
- 封裝
- -
- 庫存
- 16,003 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Microchip Technology |
|---|---|
| 產品分類 | 驅動器、接收器與收發器IC |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C |
| Package | Tray |
| Product status | Active |
| Voltage - Supply | 1.6V ~ 3.6V |
| 資料表 | 查看資料表PDF |
採購概覽
LAN8720A-CP-ABC 的主要供貨及採購資訊。
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LAN8720A-CP-ABC 詳細描述
Product Overview
The LAN8720A-CP-ABC from Microchip Technology is a surface-mount transceiver intended for Ethernet physical-layer interfacing using MII or RMII protocols. It supports full-duplex operation with two drivers and two receivers at a 100 Mbps data rate. The device operates from a 1.6 V to 3.6 V supply and is specified for an operating temperature range of 0°C to 85°C. It is supplied in a 24-SQFN (4x4) package with an exposed pad for embedded board layouts that require a media-independent interface connection.
Key Features
- MII and RMII protocol support
- 2/2 driver and receiver configuration with full duplex
- 100 Mbps data rate
- 1.6 V to 3.6 V supply range
- 0°C to 85°C operating temperature range
- 24-SQFN (4x4) surface-mount package with exposed pad
Applications
- Embedded Ethernet physical-layer interfacing
- Networked microcontroller board design
- Communications hardware requiring MII or RMII media-independent interfaces
Design & Procurement Notes
When selecting the LAN8720A-CP-ABC, confirm that the host interface supports either MII or RMII and that the board stack-up provides a supply within the 1.6 V to 3.6 V range. The 24-SQFN (4x4) package with an exposed pad requires surface-mount pad planning and adequate land pattern definition for reliable assembly. Because the device is rated for 0°C to 85°C operation, system thermal conditions should remain within that range. The 2/2 driver and receiver arrangement and full-duplex 100 Mbps data rate should be matched to the intended Ethernet physical-layer topology rather than assumed from the package size or series name. Design review should also verify interface timing and power sequencing against the final schematic before layout release.
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