LAN8710A-EZC-TR
IC TRANSCEIVER FULL 4/4 32QFN
- 產品分類
- 驅動器、接收器與收發器IC
- 封裝
- 32-VFQFN Exposed Pad
- 庫存
- 11,487 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Microchip Technology |
|---|---|
| 產品分類 | 驅動器、接收器與收發器IC |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Active |
| Supplier Device Package | 32-QFN (5x5) |
| Voltage - Supply | 1.6V ~ 3.6V |
| 資料表 | 查看資料表PDF |
採購概覽
LAN8710A-EZC-TR 的主要供貨及採購資訊。
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LAN8710A-EZC-TR 詳細描述
Product Overview
The Microchip Technology LAN8710A-EZC-TR is a surface-mount interface transceiver intended for MII and RMII connections. It provides a 4/4 driver and receiver configuration with full duplex operation at a 100Mbps data rate. The device uses a 32-VFQFN exposed pad package with a 32-QFN (5x5) device package and operates from a 1.6V to 3.6V supply across a 0°C to 85°C temperature range.
Key Features
- Microchip Technology LAN8710A-EZC-TR interface transceiver
- Supports MII and RMII protocols
- 4/4 driver and receiver architecture
- Full duplex operation at 100Mbps
- 1.6V to 3.6V supply voltage range
- 0°C to 85°C operating temperature range
- 32-VFQFN exposed pad package with 32-QFN (5x5) device package
- Surface mount mounting type
Applications
- Embedded systems requiring MII or RMII transceiver connectivity
- Data communication systems that require full duplex 100Mbps transceiver connectivity
- Equipment interfaces operating within a 0°C to 85°C ambient range
- Compact surface-mount designs using a 32-QFN (5x5) package
Design & Procurement Notes
When selecting the LAN8710A-EZC-TR, confirm that the board design can accommodate the 32-VFQFN exposed pad package and its surface-mount assembly requirements. The 1.6V to 3.6V supply range and 0°C to 85°C operating range should be matched to the system power rails and expected ambient conditions. Because the device supports MII and RMII with 4/4 drivers and receivers in full duplex at 100Mbps, verify interface mapping and signal routing during schematic and layout review. The exposed pad package should be evaluated for thermal and mechanical attachment to the board.
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