料號

LAN8710A-EZC-TR

IC TRANSCEIVER FULL 4/4 32QFN

封裝
32-VFQFN Exposed Pad
庫存
11,487 件
供貨狀態
當前數量需確認。
詢價內容包括: 價格 庫存確認 生產批次 交期
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產品屬性

製造商 Microchip Technology
產品分類 驅動器、接收器與收發器IC
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C
Package Tape & Reel (TR),Cut Tape (CT)
Product status Active
Supplier Device Package 32-QFN (5x5)
Voltage - Supply 1.6V ~ 3.6V
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採購資訊

採購概覽

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料號 LAN8710A-EZC-TR
供貨狀態 列示庫存 11,487 pcs 當前數量需確認。
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LAN8710A-EZC-TR 詳細描述

Product Overview

The Microchip Technology LAN8710A-EZC-TR is a surface-mount interface transceiver intended for MII and RMII connections. It provides a 4/4 driver and receiver configuration with full duplex operation at a 100Mbps data rate. The device uses a 32-VFQFN exposed pad package with a 32-QFN (5x5) device package and operates from a 1.6V to 3.6V supply across a 0°C to 85°C temperature range.

Key Features

  • Microchip Technology LAN8710A-EZC-TR interface transceiver
  • Supports MII and RMII protocols
  • 4/4 driver and receiver architecture
  • Full duplex operation at 100Mbps
  • 1.6V to 3.6V supply voltage range
  • 0°C to 85°C operating temperature range
  • 32-VFQFN exposed pad package with 32-QFN (5x5) device package
  • Surface mount mounting type

Applications

  • Embedded systems requiring MII or RMII transceiver connectivity
  • Data communication systems that require full duplex 100Mbps transceiver connectivity
  • Equipment interfaces operating within a 0°C to 85°C ambient range
  • Compact surface-mount designs using a 32-QFN (5x5) package

Design & Procurement Notes

When selecting the LAN8710A-EZC-TR, confirm that the board design can accommodate the 32-VFQFN exposed pad package and its surface-mount assembly requirements. The 1.6V to 3.6V supply range and 0°C to 85°C operating range should be matched to the system power rails and expected ambient conditions. Because the device supports MII and RMII with 4/4 drivers and receivers in full duplex at 100Mbps, verify interface mapping and signal routing during schematic and layout review. The exposed pad package should be evaluated for thermal and mechanical attachment to the board.

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