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料號

MX29GL320EHT2I-70G

IC FLASH 32MBIT PARALLEL 56TSOP

製造商
Macronix
產品分類
記憶體 IC
封裝
56-TFSOP (0.724", 18.40mm Width)
庫存
3,759 件
供貨狀態
當前數量需確認。
詢價內容包括: 價格 庫存確認 生產批次 交期
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產品屬性

製造商 Macronix
產品分類 記憶體 IC
Access Time 70 ns
Memory Format Flash
Memory Interface Parallel
Memory Organization 4M x 8
Memory Size 32Mbit
Memory Type Non-Volatile
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C (TA)
Package Tray
Product status Active
Series MX29GL
Supplier Device Package 56-TSOP
Technology FLASH - NOR
Voltage - Supply 2.7V ~ 3.6V
Write Cycle Time - Word, Page 70ns
資料表 查看資料表PDF
採購資訊

採購概覽

MX29GL320EHT2I-70G 的主要供貨及採購資訊。

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料號 MX29GL320EHT2I-70G
供貨狀態 列示庫存 3,759 pcs 當前數量需確認。
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MX29GL320EHT2I-70G 詳細描述

Product Overview

The MX29GL320EHT2I-70G from Macronix is a 32Mbit non-volatile FLASH memory device using NOR technology and a parallel interface. The 4M x 8 memory organization defines the address and data structure of the array, and the 70 ns access time supports read operations in systems that use a parallel memory bus. The device operates from a 2.7 V to 3.6 V supply and is specified for an ambient temperature range of -40°C to 85°C. It uses a surface-mount 56-TSOP package.

Key Features

  • 32Mbit non-volatile NOR FLASH memory with 4M x 8 organization
  • Parallel memory interface with 70 ns access time
  • 70 ns write cycle time for word/page operations
  • 2.7 V to 3.6 V supply voltage range
  • -40°C to 85°C ambient operating temperature range
  • Surface-mount 56-TSOP package with 0.724 in (18.40 mm) width
  • Part of the Macronix MX29GL series

Applications

  • Embedded controller firmware storage
  • Boot code storage in networking equipment
  • Non-volatile data logging modules
  • Program and data storage in consumer electronics

Design & Procurement Notes

When selecting this memory for a design, confirm that the host controller supports a parallel NOR flash interface and can meet the timing requirements associated with the 70 ns access and word/page write cycle time. The 4M x 8 organization determines address and data bus usage, so board routing, signal integrity, and address mapping should be planned around the 32Mbit capacity. The 2.7 V to 3.6 V supply range and -40°C to 85°C ambient operating range should be checked against the system power and thermal environment. The surface-mount 56-TSOP footprint, with a 0.724 in (18.40 mm) width, affects PCB layout and reflow processing. Procurement should verify the exact package code and mechanical footprint to avoid mismatches during board assembly.

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