IS42S32800J-6BLI
IC DRAM 256MBIT PAR 90TFBGA
- 產品分類
- 記憶體 IC
- 封裝
- 90-TFBGA
- 庫存
- 6,313 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | ISSI, Integrated Silicon Solution Inc |
|---|---|
| 產品分類 | 記憶體 IC |
| Access Time | 5.4 ns |
| Clock Frequency | 166 MHz |
| Memory Format | DRAM |
| Memory Interface | Parallel |
| Memory Organization | 8M x 32 |
| Memory Size | 256Mbit |
| Memory Type | Volatile |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package | Tray |
| Product status | Active |
| Supplier Device Package | 90-TFBGA (8x13) |
| Technology | SDRAM |
| Voltage - Supply | 3V ~ 3.6V |
| 資料表 | 查看資料表PDF |
採購概覽
IS42S32800J-6BLI 的主要供貨及採購資訊。
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IS42S32800J-6BLI 詳細描述
Product Overview
The IS42S32800J-6BLI from ISSI, Integrated Silicon Solution Inc is a volatile DRAM memory integrated circuit based on SDRAM technology. It provides 256Mbit of memory organized as 8M x 32 and uses a parallel memory interface. The device operates from a 3V to 3.6V supply and is specified for a 166 MHz clock frequency with a 5.4 ns access time. It uses a 90-TFBGA (8x13) surface-mount package for board-mounted assembly.
Key Features
- 256Mbit volatile DRAM memory capacity
- 8M x 32 memory organization
- Parallel memory interface
- 166 MHz clock frequency
- 5.4 ns access time
- 3V to 3.6V supply voltage range
- -40°C to 85°C operating temperature range (TA)
- 90-TFBGA (8x13) surface-mount package
Applications
- Embedded processing systems that use parallel SDRAM as volatile working memory
- Data buffer subsystems requiring a 256Mbit parallel memory interface
- Controller platforms operating with a 3V to 3.6V memory supply
Design & Procurement Notes
When selecting the IS42S32800J-6BLI, confirm that the memory controller supports a parallel SDRAM interface, the 8M x 32 organization, and the 166 MHz clock frequency. The 5.4 ns access time should be evaluated within the system timing budget. The 3V to 3.6V supply range must match the system power architecture, and the -40°C to 85°C (TA) range should be checked against expected ambient conditions. Board layout should account for the 90-TFBGA (8x13) surface-mount footprint, including pad geometry and routing density. Because the device is volatile DRAM, system power must remain present for data retention.
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