S29GL01GS11FHIV23
IC FLASH 1GBIT PARALLEL 64FBGA
- 產品分類
- 記憶體 IC
- 封裝
- 64-LBGA
- 庫存
- 3,844 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Infineon Technologies |
|---|---|
| 產品分類 | 記憶體 IC |
| Access Time | 110 ns |
| Memory Format | Flash |
| Memory Interface | Parallel |
| Memory Organization | 64M x 16 |
| Memory Size | 1Gbit |
| Memory Type | Non-Volatile |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Active |
| Series | GL-S |
| Supplier Device Package | 64-FBGA (13x11) |
| Technology | FLASH - NOR |
| Voltage - Supply | 1.65V ~ 3.6V |
| Write Cycle Time - Word, Page | 60ns |
| 資料表 | 查看資料表PDF |
採購概覽
S29GL01GS11FHIV23 的主要供貨及採購資訊。
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S29GL01GS11FHIV23 詳細描述
Product Overview
The Infineon Technologies S29GL01GS11FHIV23 is a non-volatile FLASH NOR memory IC offering 1Gbit of storage in a 64M x 16 organization. It uses a parallel memory interface and is supplied in a 64-LBGA surface-mount package, corresponding to a 64-FBGA (13x11) device package. The part is specified for a 1.65V to 3.6V supply range and a -40°C to 85°C operating temperature range (TA).
Key Features
- 1Gbit non-volatile FLASH NOR memory with 64M x 16 organization.
- Parallel interface with 110 ns access time and 60 ns word/page write cycle time.
- Operates from a 1.65V to 3.6V supply and supports -40°C to 85°C (TA).
- Surface-mount 64-LBGA package with 64-FBGA (13x11) device package.
Applications
- Firmware or program-code storage in embedded systems that use a parallel memory bus.
- Persistent retention of configuration or calibration data in systems that require non-volatile storage without power.
- Memory expansion for 16-bit parallel data paths in hardware designs.
Design & Procurement Notes
Design teams should verify that the host controller supports a parallel memory interface and can meet the 110 ns access timing and 60 ns word/page write cycle requirements. The 64M x 16 organization is relevant for address and data bus mapping, while the 1.65V to 3.6V supply range should be checked against the board power architecture. The surface-mount 64-LBGA / 64-FBGA (13x11) package requires appropriate footprint, land pattern, and thermal considerations, and the -40°C to 85°C (TA) operating range should be confirmed for the intended environment.
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