CY9AF144MABGL-GK9E1
IC MCU 32BIT 288KB FLASH 96FBGA
- 產品分類
- 微控制器 - MCU
- 封裝
- 96-LFBGA
- 庫存
- 4,900 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Infineon Technologies |
|---|---|
| 產品分類 | 微控制器 - MCU |
| Connectivity | CSIO, EBI/EMI, I2C, SPI, UART/USART |
| Core Processor | ARM® Cortex®-M3 |
| Core Size | 32-Bit Single-Core |
| Data Converters | A/D 17x12b |
| Mounting Type | Surface Mount |
| Number of I/O | 66 |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Oscillator Type | Internal |
| Package | Tray |
| Peripherals | LVD, POR, PWM, WDT |
| Product status | Active |
| Program Memory Size | 288KB (288K x 8) |
| Program Memory Type | Flash |
| RAM Size | 32K x 8 |
| Series | FM3 MB9A140NB |
| Speed | 40MHz |
| Supplier Device Package | 96-FBGA (6x6) |
| Voltage - Supply (Vcc/Vdd) | 1.65V ~ 3.6V |
| 資料表 | 查看資料表PDF |
採購概覽
CY9AF144MABGL-GK9E1 的主要供貨及採購資訊。
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CY9AF144MABGL-GK9E1 詳細描述
Product Overview
The CY9AF144MABGL-GK9E1 from Infineon Technologies is a 32-bit microcontroller based on the ARM® Cortex®-M3 core, with 40MHz speed. It is part of the FM3 MB9A140NB series and provides 288KB (288K x 8) FLASH program memory, 32K x 8 RAM, and 66 I/O pins. Connectivity includes CSIO, EBI/EMI, I2C, SPI, and UART/USART. The device integrates a 17x12-bit A/D converter, an internal oscillator, and on-chip functions including LVD, POR, PWM, and WDT. It operates from 1.65V to 3.6V over -40°C to 85°C (TA) in a 96-FBGA (6x6) / 96-LFBGA surface-mount package.
Key Features
- ARM® Cortex®-M3 32-bit core with 40MHz speed.
- 288KB (288K x 8) FLASH program memory and 32K x 8 RAM.
- 66 I/O pins with CSIO, EBI/EMI, I2C, SPI, and UART/USART connectivity.
- 17x12-bit A/D converter and internal oscillator.
- On-chip functions include LVD, POR, PWM, and WDT.
- 1.65V to 3.6V supply range, -40°C to 85°C (TA) operating temperature, and 96-FBGA (6x6) / 96-LFBGA surface-mount package.
Applications
- Embedded control subsystems that use a 32-bit core, FLASH program storage, and multiple serial interfaces.
- Analog input processing in compact embedded modules using the 17x12-bit A/D converter.
- Peripheral expansion or external memory interfacing through CSIO and EBI/EMI.
- Embedded assemblies that use LVD, POR, and WDT as on-chip power and timing functions.
Design & Procurement Notes
When selecting this device, verify that the board layout supports the 96-FBGA (6x6) / 96-LFBGA surface-mount package and that the system supply remains within 1.65V to 3.6V. The internal oscillator and 40MHz core reduce external clocking complexity, but timing-sensitive interfaces, A/D sampling, and EBI/EMI access should be validated under the final voltage and temperature conditions. The 66 I/O count, serial interfaces, and analog channels should be mapped against the required communication, control, and sensor functions. The -40°C to 85°C (TA) range should be checked against the enclosure, thermal dissipation, and ambient environment of the finished assembly.
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