料號

CY8C6347BZI-BLD53

IC MCU 32BIT 1MB FLASH 116BGA

產品分類
微控制器 - MCU
封裝
116-WFBGA
庫存
6,933 件
供貨狀態
當前數量需確認。
詢價內容包括: 價格 庫存確認 生產批次 交期
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產品屬性

製造商 Infineon Technologies
產品分類 微控制器 - MCU
Connectivity I2C, LINbus, QSPI, SPI, UART/USART, USB
Core Processor ARM® Cortex®-M4/M0
Core Size 32-Bit Dual-Core
Data Converters A/D 8x12b SAR; D/A 1x12b
EEPROM Size 32K x 8
Mounting Type Surface Mount
Number of I/O 78
Operating Temperature -40°C ~ 85°C (TA)
Oscillator Type Internal
Package Tray
Peripherals Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT
Product status Active
Program Memory Size 1MB (1M x 8)
Program Memory Type Flash
RAM Size 288K x 8
Series PSoC® 6 BLE
Speed 100MHz, 150MHz
Supplier Device Package 116-BGA (5.2x6.4)
Voltage - Supply (Vcc/Vdd) 1.7V ~ 3.6V
資料表 查看資料表PDF
採購資訊

採購概覽

CY8C6347BZI-BLD53 的主要供貨及採購資訊。

查詢價格及供貨
料號 CY8C6347BZI-BLD53
供貨狀態 列示庫存 6,933 pcs 當前數量需確認。
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測試支援
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CY8C6347BZI-BLD53 詳細描述

Product Overview

The Infineon Technologies CY8C6347BZI-BLD53 is a 32-bit dual-core microcontroller from the PSOC 6 BLE family. It combines ARM Cortex-M4 and Cortex-M0 cores with 1MB (1M x 8) FLASH program memory, 288K x 8 RAM, and 32K x 8 EEPROM. The device operates from 1.7V to 3.6V and supports speeds of 100MHz and 150MHz. It provides 78 I/O and is offered in a 116-BGA (5.2x6.4) / 116-WFBGA surface-mount package with an internal oscillator and an operating temperature range of -40°C to 85°C (TA).

Key Features

  • 32-bit dual-core architecture using ARM Cortex-M4 and Cortex-M0 processors.
  • 1MB (1M x 8) FLASH program memory, 288K x 8 RAM, and 32K x 8 EEPROM.
  • 78 I/O with interfaces including I2C, LINbus, QSPI, SPI, UART/USART, and USB.
  • Bluetooth peripheral plus Cap Sense, LCD, I2S, PWM, DMA, Brown-out Detect/Reset, POR, and WDT.
  • 8-channel 12-bit SAR ADC and 1-channel 12-bit DAC.
  • 1.7V to 3.6V supply range, internal oscillator, and -40°C to 85°C (TA) operating temperature.
  • 116-BGA (5.2x6.4) / 116-WFBGA surface-mount package.

Applications

  • Battery-powered wireless sensor and control nodes that use Bluetooth for local data exchange.
  • Embedded user interfaces with capacitive touch, LCD display, and analog sensing.
  • Communication gateways that connect USB, serial, SPI, I2C, or LINbus subsystems.
  • Instrumentation and monitoring equipment requiring ADC and DAC channels with timing peripherals.

Design & Procurement Notes

Designers should plan board layout and power delivery for the 1.7V to 3.6V supply range and the 116-BGA (5.2x6.4) / 116-WFBGA surface-mount package. The 78 I/O and multiple serial interfaces support mixed-signal and communication subsystems, while the 12-bit ADC and DAC channels allow sensor acquisition and analog output tasks. The internal oscillator should be considered when selecting clocking architecture, and the -40°C to 85°C (TA) range, Bluetooth, Cap Sense, LCD, DMA, PWM, watchdog, and power-on reset peripherals should be mapped to system requirements during schematic and firmware planning.

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