S29GL01GP13FFIV20
IC FLASH 1GBIT PARALLEL 64FBGA
- 產品分類
- 記憶體 IC
- 封裝
- 64-LBGA
- 庫存
- 6,953 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Cypress Semiconductor Corp |
|---|---|
| 產品分類 | 記憶體 IC |
| Access Time | 130 ns |
| Memory Format | Flash |
| Memory Interface | Parallel |
| Memory Organization | 128M x 8 |
| Memory Size | 1Gbit |
| Memory Type | Non-Volatile |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Package | Tray |
| Product status | Obsolete |
| Series | GL-P |
| Supplier Device Package | 64-FBGA (13x11) |
| Technology | FLASH - NOR |
| Voltage - Supply | 1.65V ~ 3.6V |
| Write Cycle Time - Word, Page | 130ns |
| 資料表 | 查看資料表PDF |
採購概覽
S29GL01GP13FFIV20 的主要供貨及採購資訊。
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S29GL01GP13FFIV20 詳細描述
Product Overview
The Cypress Semiconductor Corp S29GL01GP13FFIV20 is a GL-P series FLASH - NOR memory IC with 1 Gbit capacity and a 128M x 8 organization. It uses a parallel memory interface and is packaged in a 64-FBGA (13x11) surface-mount package. The device operates from a 1.65 V to 3.6 V supply and is specified for an ambient temperature range of -40°C to 85°C. Access time and word/page write cycle time are both 130 ns.
Key Features
- 1 Gbit non-volatile FLASH - NOR memory format.
- 128M x 8 memory organization for parallel data access.
- Parallel memory interface with 130 ns access time.
- 130 ns write cycle time for word or page operations.
- 1.65 V to 3.6 V supply voltage range.
- -40°C to 85°C operating temperature range (TA).
- Surface-mount 64-FBGA (13x11) package.
Applications
- Program or firmware storage in embedded systems that use a parallel memory bus.
- Persistent configuration or data retention in systems requiring non-volatile storage across power cycles.
- High-density non-volatile memory in space-constrained surface-mount designs using a 64-FBGA package.
Design & Procurement Notes
When selecting this device, verify that the host controller provides a parallel memory bus and can meet the 130 ns timing requirement at the intended supply voltage. The 1.65 V to 3.6 V range should be checked against the system power architecture. The 64-FBGA (13x11) footprint requires surface-mount assembly and appropriate land pattern planning. The -40°C to 85°C (TA) range should be compared with expected enclosure or ambient conditions. The 128M x 8 organization and 1 Gbit capacity determine address and data width requirements.
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