料號

FM25640B-G2

IC FRAM 64KBIT SPI 20MHZ 8SOIC

產品分類
記憶體 IC
封裝
8-SOIC (0.154", 3.90mm Width)
庫存
6,379 件
供貨狀態
當前數量需確認。
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產品屬性

製造商 Cypress Semiconductor Corp
產品分類 記憶體 IC
Clock Frequency 20 MHz
Memory Format FRAM
Memory Interface SPI
Memory Organization 8K x 8
Memory Size 64Kbit
Memory Type Non-Volatile
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C (TA)
Package Tube
Product status Obsolete
Series F-RAM™
Supplier Device Package 8-SOIC
Technology FRAM (Ferroelectric RAM)
Voltage - Supply 4.5V ~ 5.5V
資料表 查看資料表PDF
採購資訊

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FM25640B-G2 的主要供貨及採購資訊。

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料號 FM25640B-G2
供貨狀態 列示庫存 6,379 pcs 當前數量需確認。
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FM25640B-G2 詳細描述

Product Overview

The FM25640B-G2 from Cypress Semiconductor Corp, in the F-RAM™ series, is a non-volatile memory IC based on FRAM (Ferroelectric RAM) technology. The device provides 64Kbit of storage arranged in an 8K x 8 organization and uses an SPI serial interface with a 20 MHz clock frequency. It operates from a 4.5V to 5.5V supply and is specified for an ambient operating temperature range of -40°C to 85°C (TA). The part is supplied in an 8-SOIC surface-mount package with a 0.154 in (3.90 mm) body width, supporting compact embedded memory subsystems that require serial communication and non-volatile data retention.

Key Features

  • 64Kbit FRAM memory with 8K x 8 organization
  • Non-volatile ferroelectric RAM technology for data retention
  • SPI serial interface supporting a 20 MHz clock frequency
  • 4.5V to 5.5V supply voltage range
  • -40°C to 85°C (TA) operating temperature range
  • 8-SOIC surface-mount package with 0.154 in / 3.90 mm width

Applications

  • Embedded controllers that need non-volatile storage for configuration, calibration, or parameter data
  • Instrumentation systems using an SPI-connected memory to retain measurement history or settings
  • Data-logging modules requiring non-volatile records across power interruptions

Design & Procurement Notes

Design considerations should align the host microcontroller or processor SPI timing with the device's 20 MHz clock specification and verify that the system supply remains within 4.5V to 5.5V. The 8K x 8 organization should be mapped to the intended data structure, while the 8-SOIC footprint and surface-mount mounting should be checked against PCB assembly and spacing constraints. The -40°C to 85°C (TA) range should be considered for the expected ambient environment, and power-loss behavior should be evaluated in the context of non-volatile FRAM storage.

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