CY62128BLL-70ZAXE
IC SRAM 1MBIT PARALLEL 32TSOP
- 產品分類
- 記憶體 IC
- 封裝
- 32-TFSOP (0.465", 11.80mm Width)
- 庫存
- 4,143 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Cypress Semiconductor Corp |
|---|---|
| 產品分類 | 記憶體 IC |
| Access Time | 70 ns |
| Memory Format | SRAM |
| Memory Interface | Parallel |
| Memory Organization | 128K x 8 |
| Memory Size | 1Mbit |
| Memory Type | Volatile |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Package | Bulk |
| Product status | Active |
| Series | MoBL® |
| Supplier Device Package | 32-TSOP |
| Technology | SRAM - Asynchronous |
| Voltage - Supply | 4.5V ~ 5.5V |
| Write Cycle Time - Word, Page | 70ns |
| 資料表 | 查看資料表PDF |
採購概覽
CY62128BLL-70ZAXE 的主要供貨及採購資訊。
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CY62128BLL-70ZAXE 詳細描述
Product Overview
The CY62128BLL-70ZAXE from Cypress Semiconductor Corp is a 1 Mbit asynchronous SRAM intended for parallel-bus embedded systems. It provides a volatile 128K x 8 memory organization with a 70 ns access time and a 70 ns write cycle time. This configuration suits designs that use an 8-bit parallel memory bus. The device operates from a 4.5 V to 5.5 V supply across -40°C to 125°C TA. It uses a surface-mount 32-TSOP package with a 32-TFSOP case width of 0.465 in / 11.80 mm.
Key Features
- Asynchronous SRAM technology.
- 1 Mbit volatile SRAM with a 128K x 8 organization.
- Parallel memory interface for byte-wide data access.
- 70 ns access time and 70 ns write cycle time.
- 4.5 V to 5.5 V supply voltage range.
- Operating temperature range of -40°C to 125°C TA.
- Surface-mount 32-TSOP package with 32-TFSOP 0.465 in / 11.80 mm width.
Applications
- Embedded controller memory expansion using a parallel SRAM interface.
- Temporary data buffering in microprocessor-based designs.
- Volatile working storage in 5 V logic systems.
Design & Procurement Notes
Designers should verify that the host parallel bus can meet the 70 ns access and write timing and that the system supply remains within 4.5 V to 5.5 V. The 128K x 8 organization suits byte-wide addressing, while the 32-TSOP surface-mount footprint requires pad layout compatibility with a 0.465 in / 11.80 mm package. Consider decoupling, trace length, and thermal margin for operation across the -40°C to 125°C ambient range.
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