CY2304SI-2
IC ZD BUFFER 8SOIC
- 產品分類
- 時脈產生器、鎖相迴路與頻率合成器
- 封裝
- 8-SOIC (0.154", 3.90mm Width)
- 庫存
- 9,634 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Cypress Semiconductor Corp |
|---|---|
| 產品分類 | 時脈產生器、鎖相迴路與頻率合成器 |
| Differential - Input:Output | No/No |
| Input | Clock |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Output | Clock |
| Package | Bulk |
| Product status | Active |
| Ratio - Input:Output | 1:4 |
| Supplier Device Package | 8-SOIC |
| Type | Zero Delay Buffer |
| Voltage - Supply | 3V ~ 3.6V |
| 資料表 | 查看資料表PDF |
採購概覽
CY2304SI-2 的主要供貨及採購資訊。
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CY2304SI-2 詳細描述
Product Overview
The CY2304SI-2 from Cypress Semiconductor Corp is a zero delay buffer integrated circuit intended for clock signal handling in digital systems. The device accepts a clock input and provides a clock output with a specified 1:4 input-to-output ratio. Its interface is single-ended at both input and output, and it operates from a 3.0 V to 3.6 V supply. The component is supplied in an 8-SOIC surface-mount package with a 0.154 in / 3.90 mm body width. Its rated operating temperature range is -40°C to 85°C ambient.
Key Features
- Zero Delay Buffer type for clock signal handling.
- Accepts a clock input and provides a clock output.
- Specified input-to-output ratio is 1:4.
- Input and output are single-ended rather than differential.
- Supply voltage range is 3.0 V to 3.6 V.
- Operating temperature range is -40°C to 85°C ambient.
- Surface-mount 8-SOIC package with 0.154 in / 3.90 mm width.
Applications
- Single-ended clock signal distribution in digital circuit boards.
- Clock path buffering in embedded systems powered at 3.0 V to 3.6 V.
- Timing signal routing in assemblies rated for -40°C to 85°C ambient operation.
- Surface-mount implementation of a zero delay buffer in compact board layouts.
Design & Procurement Notes
When selecting the CY2304SI-2, confirm that the board supply remains within 3.0 V to 3.6 V and that the ambient temperature stays within -40°C to 85°C. The single-ended input and output require non-differential clock routing, so differential clock interfaces should not be assumed without separate verification. The 8-SOIC surface-mount package has a 0.154 in / 3.90 mm width, so pad layout, soldering profile, and thermal management should match this footprint. The 1:4 input-to-output ratio should be aligned with the intended clock topology and downstream signal requirements.
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