CHF190104CBF500L

Product Overview

CHF190104CBF500L from Bourns Inc. is a high-power RF flanged chip termination / resistor used in RF, microwave or high-speed receiver signal-chain designs. This description focuses on practical RF function, operating range, interface requirements and sourcing relevance for engineering and procurement teams.

The exact suffix should be checked against the original BOM because RF performance, package, temperature range and reel format may vary across closely related orderable part numbers.

Key Features

• Manufacturer: Bourns Inc.
• Part Number: CHF190104CBF500L
• Device Type: high-power RF flanged chip termination / resistor
• RF Function: thick-film RF power termination or resistor for high-power transmission and dummy-load paths
• Frequency / Band: DC to 1 GHz
• Core Specification 1: CHF190104xBF high-power RF flanged chip termination/resistor series
• Core Specification 2: 800 W power rating family when properly heat-sunk
• Core Specification 3: Low VSWR, 1.2 maximum class in referenced series literature
• Core Specification 4: Resistance values include 12.5 Ω, 25 Ω, 50 Ω and 100 Ω based on suffix
• Core Specification 5: Flanged BeO substrate RF power component
• Supply / Bias: passive RF component, no DC supply required
• Interface / Output: solder/tab RF connection with heat-sink mounting
• Operating Temperature: -55°C to +150°C heat-sink temperature curve class in referenced literature
• Design Notes: Confirm the exact ordering suffix, package option, temperature grade and application circuit before replacing the part in an existing RF design.

Applications

High-power RF transmitters, dummy loads, amplifier output loads, RF test fixtures and termination networks.

Maintenance and sourcing for RF power assemblies where resistance value, heat sinking and flange footprint must match.

Quality & Sourcing

Antrex Electronics can support sourcing for CHF190104CBF500L through available stock checks, BOM consolidation and alternative-lot review. For RF and microwave components, packaging condition, date code, MSL handling and original labeling should be checked before shipment.

For project builds, repair support or shortage coverage, Antrex Electronics can coordinate visual inspection, package verification and third-party testing when required. This helps buyers manage risk when sourcing discontinued, legacy or hard-to-find RF misc ICs and modules.