MAX3088EESA+T
IC TRANSCEIVER HALF 1/1 8SOIC
- 製造商
- Maxim Integrated
- 產品分類
- 驅動器、接收器與收發器IC
- 封裝
- 8-SOIC (0.154", 3.90mm Width)
- 庫存
- 8,605 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Maxim Integrated |
|---|---|
| 產品分類 | 驅動器、接收器與收發器IC |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C |
| Package | Tape & Reel (TR),Cut Tape (CT) |
| Product status | Active |
| Voltage - Supply | 4.75V ~ 5.25V |
| 資料表 | 查看資料表PDF |
採購概覽
MAX3088EESA+T 的主要供貨及採購資訊。
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MAX3088EESA+T 詳細描述
Product Overview
The MAX3088EESA+T from Analog Devices Inc./Maxim Integrated is a surface-mount interface transceiver intended for half-duplex serial communication over RS422 and RS485 buses. The device combines one driver and one receiver in an 8-SOIC package and operates from a 4.75 V to 5.25 V supply. Its specified data rate is 10 Mbps, and its receiver input hysteresis is 100 mV. The part is characterized for operation from -40°C to 85°C, supporting board-level designs that require a compact 8-SOIC footprint, a single 5 V supply, and conventional RS422/RS485 physical-layer signaling.
Key Features
- Half-duplex transceiver with one driver and one receiver
- Supports RS422 and RS485 protocols
- Specified data rate of 10 Mbps
- Receiver hysteresis of 100 mV
- 5 V supply operation from 4.75 V to 5.25 V
- Operating temperature range of -40°C to 85°C
- Surface-mount 8-SOIC package with 0.154 in, 3.90 mm width
Applications
- Half-duplex serial links between controllers and remote I/O modules
- RS422 or RS485 bus segments for data collection devices
- Serial communication between embedded host processors and field instruments
Design & Procurement Notes
Designers should verify that the host system provides a 4.75 V to 5.25 V supply and that the board layout supports the 8-SOIC footprint and surface-mount assembly. The 10 Mbps data rate and 100 mV receiver hysteresis are relevant to bus topology, signal integrity, and noise margin planning. Because the device is a half-duplex 1/1 transceiver, protocol-level control must manage direction switching between transmit and receive states. The -40°C to 85°C operating range should be considered in thermal and enclosure design, while the 8-SOIC package width of 0.154 in, 3.90 mm affects pad spacing and routing.
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