料號

MAX3088EESA+T

IC TRANSCEIVER HALF 1/1 8SOIC

製造商
Maxim Integrated
封裝
8-SOIC (0.154", 3.90mm Width)
庫存
8,605 件
供貨狀態
當前數量需確認。
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產品屬性

製造商 Maxim Integrated
產品分類 驅動器、接收器與收發器IC
Mounting Type Surface Mount
Operating Temperature -40°C ~ 85°C
Package Tape & Reel (TR),Cut Tape (CT)
Product status Active
Voltage - Supply 4.75V ~ 5.25V
資料表 查看資料表PDF
採購資訊

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MAX3088EESA+T 的主要供貨及採購資訊。

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料號 MAX3088EESA+T
供貨狀態 列示庫存 8,605 pcs 當前數量需確認。
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MAX3088EESA+T 詳細描述

Product Overview

The MAX3088EESA+T from Analog Devices Inc./Maxim Integrated is a surface-mount interface transceiver intended for half-duplex serial communication over RS422 and RS485 buses. The device combines one driver and one receiver in an 8-SOIC package and operates from a 4.75 V to 5.25 V supply. Its specified data rate is 10 Mbps, and its receiver input hysteresis is 100 mV. The part is characterized for operation from -40°C to 85°C, supporting board-level designs that require a compact 8-SOIC footprint, a single 5 V supply, and conventional RS422/RS485 physical-layer signaling.

Key Features

  • Half-duplex transceiver with one driver and one receiver
  • Supports RS422 and RS485 protocols
  • Specified data rate of 10 Mbps
  • Receiver hysteresis of 100 mV
  • 5 V supply operation from 4.75 V to 5.25 V
  • Operating temperature range of -40°C to 85°C
  • Surface-mount 8-SOIC package with 0.154 in, 3.90 mm width

Applications

  • Half-duplex serial links between controllers and remote I/O modules
  • RS422 or RS485 bus segments for data collection devices
  • Serial communication between embedded host processors and field instruments

Design & Procurement Notes

Designers should verify that the host system provides a 4.75 V to 5.25 V supply and that the board layout supports the 8-SOIC footprint and surface-mount assembly. The 10 Mbps data rate and 100 mV receiver hysteresis are relevant to bus topology, signal integrity, and noise margin planning. Because the device is a half-duplex 1/1 transceiver, protocol-level control must manage direction switching between transmit and receive states. The -40°C to 85°C operating range should be considered in thermal and enclosure design, while the 8-SOIC package width of 0.154 in, 3.90 mm affects pad spacing and routing.

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