LTC485IN8#PBF
IC TRANSCEIVER HALF 1/1 8DIP
- 產品分類
- 驅動器、接收器與收發器IC
- 封裝
- 8-DIP (0.300", 7.62mm)
- 庫存
- 4,019 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Analog Devices Inc. |
|---|---|
| 產品分類 | 驅動器、接收器與收發器IC |
| Mounting Type | Through Hole |
| Operating Temperature | -40°C ~ 85°C |
| Package | Tube |
| Product status | Active |
| Voltage - Supply | 4.75V ~ 5.25V |
| 資料表 | 查看資料表PDF |
採購概覽
LTC485IN8#PBF 的主要供貨及採購資訊。
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LTC485IN8#PBF 詳細描述
Product Overview
The LTC485IN8#PBF from Analog Devices Inc. is a through-hole interface transceiver for RS422 and RS485 signaling. It integrates one driver and one receiver in an 8-PDIP package and operates from a 4.75 V to 5.25 V supply. The device supports half-duplex operation, with a 70 mV receiver hysteresis and an operating temperature range of -40°C to 85°C. Its 8-DIP (0.300 in, 7.62 mm) package uses through-hole mounting.
Key Features
- RS422 and RS485 protocol support
- 1/1 driver and receiver configuration
- Half-duplex transceiver architecture
- 70 mV receiver hysteresis
- 4.75 V to 5.25 V supply range
- -40°C to 85°C operating temperature range
- Through-hole 8-PDIP package with 0.300 in, 7.62 mm pitch
Applications
- Industrial control panels using RS485 communication links
- Instrumentation and test equipment interfaces with RS422 or RS485
- Building automation subsystems requiring half-duplex serial bus connections
- Embedded development boards and through-hole interface modules
Design & Procurement Notes
For board layout, the 8-PDIP through-hole package requires holes and spacing consistent with a 0.300 in, 7.62 mm pitch. For procurement, specify the exact part number and 8-PDIP package. The 8-pin package also affects pin access and routing density on through-hole boards. The 4.75 V to 5.25 V supply range should be matched by the local power rail. Because the transceiver is half-duplex, system timing must separate transmit and receive states on the shared bus. The 70 mV receiver hysteresis should be considered when evaluating receiver input behavior. The -40°C to 85°C operating range should be considered in thermal layout.
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