LTC2862CS8-2#PBF
IC TRANSCEIVER HALF 1/1 8SO
- 產品分類
- 驅動器、接收器與收發器IC
- 封裝
- 8-SOIC (0.154", 3.90mm Width)
- 庫存
- 6,507 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Analog Devices Inc. |
|---|---|
| 產品分類 | 驅動器、接收器與收發器IC |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 70°C |
| Package | Tube |
| Product status | Active |
| Voltage - Supply | 3V ~ 5.5V |
| 資料表 | 查看資料表PDF |
採購概覽
LTC2862CS8-2#PBF 的主要供貨及採購資訊。
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LTC2862CS8-2#PBF 詳細描述
Product Overview
The LTC2862CS8-2#PBF from Analog Devices Inc. is a 1/1 transceiver for RS422 and RS485 serial interfaces. It operates in a half-duplex mode and provides one driver and one receiver in an 8-SOIC surface-mount package with a 0.154 in, 3.90 mm width. The device accepts a 3V to 5.5V supply and is specified for a 250kbps data rate. Its 150mV receiver hysteresis is a receiver characteristic for differential serial links, while the 0°C to 70°C operating range defines the ambient conditions for normal use.
Key Features
- RS422 and RS485 protocol support
- 1/1 half-duplex transceiver architecture
- 250kbps data rate
- 150mV receiver hysteresis
- 3V to 5.5V supply voltage range
- 0°C to 70°C operating temperature range
- Surface-mount 8-SOIC package with 3.90 mm width
- Single driver and single receiver configuration
Applications
- embedded board-to-board serial communication
- instrumentation data acquisition links
- control-system communication buses
- point-to-point differential serial links
Design & Procurement Notes
Design reviews should confirm that the system supply remains within 3V to 5.5V and that the local ambient environment stays between 0°C and 70°C. The 8-SOIC surface-mount package requires a compatible footprint and solder process. Because the device is a 1/1 half-duplex transceiver, the link topology and protocol timing should be matched to the host or controller design. The 250kbps data rate should be compared with the required link speed, and the 150mV receiver hysteresis should be considered when evaluating input signal margins. Procurement comparisons should focus on package size, supply range, protocol compatibility, and thermal limits.
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