HMC579
IC MULTI ACTIVE DIE
- 產品分類
- 其他射頻積體電路與模組
- 封裝
- Die
- 庫存
- 250 件
- 供貨狀態
- 當前數量需確認。
產品屬性
| 製造商 | Analog Devices Inc. |
|---|---|
| 產品分類 | 其他射頻積體電路與模組 |
| Frequency | 32GHz ~ 46GHz |
| Function | Frequency Multiplier |
| Min Qty | 50 |
| Mounting Type | Surface Mount |
| Package | Tray |
| Product status | Active |
| RF Type | VSAT |
| Supplier Device Package | Die |
| 資料表 | 查看資料表PDF |
採購概覽
HMC579 的主要供貨及採購資訊。
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如有需要，可安排外觀檢查、X-ray 及第三方測試支援。
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HMC579 詳細描述
Product Overview
HMC579 from Analog Devices Inc. is a GaAs MMIC x2 active broadband frequency multiplier die used in RF, microwave or high-speed signal-chain designs. This description focuses on practical electrical parameters, interface requirements and sourcing relevance for engineering and procurement teams.
The exact ordering suffix should be checked for package style, reel or tray format, temperature grade and board-level compatibility before replacing an existing design.
Key Features
- Manufacturer: Analog Devices Inc.
- Part Number: HMC579
- Device Type: GaAs MMIC x2 active broadband frequency multiplier die
- Functional Role: 32 GHz to 46 GHz millimeter-wave LO and clock generation chains
- Function: x2 active broadband frequency multiplier die
- Output Frequency: 32 GHz to 46 GHz output range
- Input Drive: +3 dBm nominal drive condition
- Output Power: +13 dBm typical output power
- Isolation: Fo isolation greater than 25 dBc at 38 GHz
- Phase Noise: low additive SSB phase noise around -127 dBc/Hz at 100 kHz offset
- Package / Case: bare die / chip option requiring microwave assembly practices
- Design Notes: Confirm the exact suffix, package drawing, temperature grade, RF evaluation layout and bias/control sequence before substitution or production approval.
Applications
Millimeter-wave LO chains, test instrumentation, military EW/radar, VSAT radios and space-qualified assemblies.
Die-level replacement or hybrid-module builds where HMC579 output power and chip assembly flow must be controlled.
Quality & Sourcing
Antrex Electronics can support sourcing for HMC579 through available stock checks, BOM consolidation and alternative-lot review. For RF and microwave ICs, package markings, moisture sensitivity, date code and original labeling should be checked before shipment.
For shortage coverage, repair builds or production support, Antrex Electronics can coordinate visual inspection, package verification and third-party testing when required. This helps buyers reduce risk when sourcing discontinued, legacy or hard-to-find RF miscellaneous ICs and modules.
探索更多採購選項
可按製造商、產品分類或採購需求繼續尋找合適料號。
