THGBMHG8C4LBAAR
THGBMHG8C4LBAAR is a Toshiba/KIOXIA 32GB eMMC NAND Flash memory device featuring high-speed storage, integrated controller, and FBGA packaging for embedded applications
- ПРОИЗВОДИТЕЛЬ
- Toshiba Semiconductor and Storage
- КАТЕГОРИЯ ТОВАРА
- Микросхемы памяти
- Корпус
- BGA
- Склад
- 1,500 шт.
- Наличие
- Текущее количество требует подтверждения.
Характеристики товара
| ПРОИЗВОДИТЕЛЬ | Toshiba Semiconductor and Storage |
|---|---|
| КАТЕГОРИЯ ТОВАРА | Микросхемы памяти |
| Applications | Smartphones, Tablets, Industrial Equipment, Embedded Systems |
| Cell Type | MLC NAND Flash |
| Data Transfer Mode | HS200 / High-Speed Interface |
| eMMC Standard | JEDEC eMMC 5.0 / 5.1 Compatible |
| Error Correction | ECC Support |
| Features | High Reliability, Fast Boot Performance, Compact Storage Solution |
| I/O voltage | 1.8V / 3.3V able |
| Interface Type | eMMC Interface |
| Memory Controller | Integrated eMMC Controller |
| Memory Density | 256Gbit (32GB) |
| Memory management | Wear Leveling, Bad Block Management, Garbage Collection |
| Memory Organization | 32G x 8-bit |
| Memory Type | NAND Flash Memory |
| Mounting Style | Surface Mount Technology (SMT) |
| Operating Temperature Range | -40°C to +85°C |
| Package Size | 11.5mm x 13mm |
| Package Type | FBGA |
| Part Number | THGBMHG8C4LBAAR |
| RoHS Status | ROHS compliant |
| Supply Voltage | 2.7V to 3.6V |
| Technology | 15nm NAND Flash Process |
| Техническая документация | Запросить даташит |
Сводка по закупке
Основная информация о поставке и закупке для THGBMHG8C4LBAAR.
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Подробное описание THGBMHG8C4LBAAR
Product Overview
THGBMHG8C4LBAAR is a Toshiba e-MMC embedded NAND flash memory device designed for high-density storage applications. Integrating NAND flash memory and an embedded multimedia card controller in a compact BGA package, this device provides reliable non-volatile storage, simplified system design and efficient data management. It is suitable for mobile devices, embedded systems, industrial equipment and consumer electronics requiring compact and stable memory solutions.
Key Features
Manufacturer: Toshiba Electronic Devices & Storage Corporation
Part Number: THGBMHG8C4LBAAR
Product Type: Embedded MultiMediaCard (e-MMC) Memory
Memory Technology: NAND Flash Memory with Embedded Controller
Memory Density: High-density embedded storage solution
Interface: e-MMC Standard Interface
Package Type: BGA Package
Mounting Type: Surface Mount Technology (SMT)
Operating Voltage: Low-voltage memory operation
Memory Architecture: NAND Flash with integrated management functions
Data Storage: Non-volatile data retention capability
Controller Function: Built-in e-MMC controller for flash management
Error Management: Integrated ECC and NAND management functions
Reliability: Designed for stable embedded storage operation
Form Factor: Compact BGA embedded memory solution
Power Consumption: Optimized for low-power embedded applications
Operating Temperature Range: Commercial temperature range
Features: Compact design, integrated controller, reliable storage and easy system integration
Typical Applications: Smartphones, tablets, embedded computers, industrial controllers and consumer electronics
RoHS Status: RoHS compliant
Datasheet: THGBMHG8C4LBAAR datasheet PDF available for technical verification before production use.
Applications
THGBMHG8C4LBAAR is designed for embedded storage applications requiring high reliability, compact size and simplified memory integration. Typical applications include mobile terminals, smart devices, industrial control systems, embedded Linux platforms, automotive electronics and consumer electronic equipment.
Quality & Sourcing
Antrex Electronics can support THGBMHG8C4LBAAR sourcing with stock availability checks, RFQ quotation, package confirmation, date code review and shipment arrangement. For project-based purchasing, customers can provide quantity requirements, delivery schedules, application details and technical specifications for faster quotation support.
For quality assurance, Antrex Electronics can assist with product photos, marking verification, visual inspection and third-party testing services when required. OEM manufacturers, embedded system developers, industrial equipment suppliers and electronic component buyers are welcome to submit BOM lists or hard-to-find memory component requirements for sourcing assistance.
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