BM70BLES1FC2-0002AA
RF TXRX MODULE BT CHIP SMD
- ПРОИЗВОДИТЕЛЬ
- Microchip Technology
- КАТЕГОРИЯ ТОВАРА
- RF-трансиверы
- Корпус
- Module
- Склад
- 868 шт.
- Наличие
- Текущее количество требует подтверждения.
Характеристики товара
| ПРОИЗВОДИТЕЛЬ | Microchip Technology |
|---|---|
| КАТЕГОРИЯ ТОВАРА | RF-трансиверы |
| Antenna Type | Integrated, Chip |
| Current - Receiving | 13mA |
| Current - Transmitting | 13mA |
| Frequency | 2.4GHz |
| Memory Size | 256kB Flash, 32kB ROM, 24kB SRAM |
| Min Qty | 0 |
| Mounting Type | Surface Mount |
| Operating Temperature | -20°C ~ 70°C |
| Package | Tray |
| Power - Output | 2dBm |
| Product status | Active |
| Protocol | Bluetooth v5.0 |
| RF Family/Standard | Bluetooth |
| Sensitivity | -90dBm |
| Serial Interfaces | I2C, SPI, UART |
| Voltage - Supply | 1.9V ~ 3.6V |
| Техническая документация | Открыть техническую документацию PDF |
Сводка по закупке
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Подробное описание BM70BLES1FC2-0002AA
Product Overview
BM70BLES1FC2-0002AA is an RF transceiver IC from Microchip Technology. It provides module-level integration helps reduce RF design work while still requiring antenna and host-interface checks. It is commonly selected for embedded wireless products, sensor networks, telemetry equipment and communication modules.
For design-in, continuation sourcing or repair work, engineers should review RF matching, antenna layout, interface timing, supply filtering and firmware compatibility. The selected orderable code should also be checked for package footprint, firmware or stack support, RF band, regulatory requirements and lifecycle status before approval.
Key Features
- Manufacturer: Microchip Technology
- Part Number: BM70BLES1FC2-0002AA
- Device Type: RF transceiver IC
- Wireless / RF Technology: Bluetooth Low Energy
- RF Band / Frequency Focus: RF operating band should be verified against the exact orderable part number and datasheet
- Architecture / Integration: radio transceiver architecture intended for embedded wireless communication designs
- System Design Value: module-level integration helps reduce RF design work while still requiring antenna and host-interface checks
- Host / Peripheral Interface Review: host interface, supply rails, GPIO or serial control pins should be checked against the datasheet
- Package / Case: Module
- PCB / Assembly Review: module form factor; confirm antenna option, host-board footprint, shielding, labeling and certification requirements
- Application Fit: embedded wireless products, sensor networks, telemetry equipment and communication modules
- Design Verification Notes: RF matching, antenna layout, interface timing, supply filtering and firmware compatibility
- Procurement Review: verify ordering suffix, package marking, date code, lifecycle status and approved substitutes before release
Applications
BM70BLES1FC2-0002AA is commonly used in Bluetooth Low Energy products, including beacons, wireless sensors, smart locks, wearables, medical accessories, lighting controls and compact battery-powered devices.
It is especially important to review the BLE stack version, clock source, antenna matching, sleep-current profile, package footprint and firmware migration path when continuing or replacing an existing BOM.
Quality & Sourcing
Antrex Electronics can support BM70BLES1FC2-0002AA sourcing with stock availability checks, RFQ quotation, date code review, package confirmation and shipment arrangement. For faster quotation, buyers can provide target quantity, acceptable date code, packaging preference, target price, required wireless protocol, frequency band, firmware or module version, and end-application information.
For quality control, Antrex Electronics can help arrange product photos, label review, visual inspection and third-party testing support when required. OEMs, EMS providers, wireless module manufacturers, IoT device makers, repair centers and electronic component buyers are welcome to send BOM lists or hard-to-find RF transceiver requirements for sourcing assistance.
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