TPS6591287YFFR
IC POWER
Quick Answer: The TPS6591287YFFR from Texas Instruments is a processor power management integrated circuit supplied in an 81-DSBGA package with a 3.6 mm by 3.6 mm body.
- Manufacturer
- Texas Instruments
- Product Category
- Specialized Power Management ICs (PMICs)
- Package
- 81-UFBGA, DSBGA
- Stock
- 1,481 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Texas Instruments |
|---|---|
| Product Category | Specialized Power Management ICs (PMICs) |
| Applications | Processor |
| Current - Supply | 8mA |
| Min Qty | 3000 |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 105°C |
| Package | Tape & Reel (TR) |
| Product status | Active |
| Supplier Device Package | 81-DSBGA (3.6x3.6) |
| Voltage - Supply | 2.7V ~ 5.5V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for TPS6591287YFFR.
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Detailed Description for TPS6591287YFFR
Product Overview
The TPS6591287YFFR from Texas Instruments is a processor power management integrated circuit supplied in an 81-DSBGA package with a 3.6 mm by 3.6 mm body. It is intended for processor applications and is mounted by surface-mount assembly. The device operates from a supply voltage range of 2.7 V to 5.5 V and has a supply current of 8 mA. Its specified operating temperature range is -40°C to 105°C, making it suitable for compact board layouts where processor power management is integrated close to the load.
Key Features
- Processor power management function for embedded and compact system designs.
- Supply voltage range of 2.7 V to 5.5 V.
- Supply current of 8 mA.
- Operating temperature range of -40°C to 105°C.
- 81-UFBGA, DSBGA surface-mount package with a 3.6 mm by 3.6 mm body.
Applications
- Power management for processor subsystems in compact embedded boards.
- Processor supply management in space-constrained device designs.
- Integration of processor power management functions within small surface-mount assemblies.
Design & Procurement Notes
When selecting this part, confirm that the board can provide a 2.7 V to 5.5 V supply and that the 8 mA supply current fits the system power budget. The -40°C to 105°C operating range should be checked against the expected ambient or board-level thermal environment. The 81-DSBGA package requires a compatible surface-mount footprint, stencil design, and reflow process for a 3.6 mm by 3.6 mm body. Because the device is intended for processor applications, place it near the managed processor power domains while keeping input and output connections short and thermally controlled.
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