PART NUMBER

TPS6591287YFFR

IC POWER

Quick Answer: The TPS6591287YFFR from Texas Instruments is a processor power management integrated circuit supplied in an 81-DSBGA package with a 3.6 mm by 3.6 mm body.

Manufacturer
Texas Instruments
Package
81-UFBGA, DSBGA
Stock
1,481 pcs
Availability
Current quantity subject to confirmation.
RFQ includes: Price Stock confirmation Date Code Lead Time
Product photos & testing support available on request.

Product Attributes

Manufacturer Texas Instruments
Product Category Specialized Power Management ICs (PMICs)
Applications Processor
Current - Supply 8mA
Min Qty 3000
Mounting Type Surface Mount
Operating Temperature -40°C ~ 105°C
Package Tape & Reel (TR)
Product status Active
Supplier Device Package 81-DSBGA (3.6x3.6)
Voltage - Supply 2.7V ~ 5.5V
Datasheet View Datasheet PDF
PURCHASING INFORMATION

Procurement Snapshot

Key supply and purchasing information for TPS6591287YFFR.

Check Price & Availability
Part Number TPS6591287YFFR
Availability 1,481 pcs listed Current quantity subject to confirmation.
Packaging & Condition Packaging confirmation available Manufacturer packaging, label and package condition can be reviewed on request.
Date Code & Lot Verification available Date code, lot and label details can be reviewed on request.
Inspection Support Inspection & testing support Visual review, X-ray or additional testing can be arranged.
Procurement Support Volume & shortage sourcing OEM, EMS, hard-to-find and long-term supply requirements supported.
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Detailed Description for TPS6591287YFFR

Product Overview

The TPS6591287YFFR from Texas Instruments is a processor power management integrated circuit supplied in an 81-DSBGA package with a 3.6 mm by 3.6 mm body. It is intended for processor applications and is mounted by surface-mount assembly. The device operates from a supply voltage range of 2.7 V to 5.5 V and has a supply current of 8 mA. Its specified operating temperature range is -40°C to 105°C, making it suitable for compact board layouts where processor power management is integrated close to the load.

Key Features

  • Processor power management function for embedded and compact system designs.
  • Supply voltage range of 2.7 V to 5.5 V.
  • Supply current of 8 mA.
  • Operating temperature range of -40°C to 105°C.
  • 81-UFBGA, DSBGA surface-mount package with a 3.6 mm by 3.6 mm body.

Applications

  • Power management for processor subsystems in compact embedded boards.
  • Processor supply management in space-constrained device designs.
  • Integration of processor power management functions within small surface-mount assemblies.

Design & Procurement Notes

When selecting this part, confirm that the board can provide a 2.7 V to 5.5 V supply and that the 8 mA supply current fits the system power budget. The -40°C to 105°C operating range should be checked against the expected ambient or board-level thermal environment. The 81-DSBGA package requires a compatible surface-mount footprint, stencil design, and reflow process for a 3.6 mm by 3.6 mm body. Because the device is intended for processor applications, place it near the managed processor power domains while keeping input and output connections short and thermally controlled.

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