BR93A66RFVT-WME2

Product Overview

The BR93A66RFVT-WME2 from Rohm Semiconductor is a 4Kbit non-volatile EEPROM memory IC for small embedded data storage. The device uses a Microwire serial interface and supports a 2 MHz clock frequency, with a 256 x 16 memory organization. It operates from a 2.5V to 5.5V supply and is rated for an ambient temperature range of -40°C to 105°C. The IC is packaged in an 8-TSSOP-B surface-mount package with a 4.40mm body width, and it is automotive grade with AEC-Q100 qualification. The 5ms word/page write cycle time supports storage of configuration values, calibration constants, identifiers, or other small nonvolatile data records in compact electronics assemblies.

Key Features

• 4Kbit non-volatile EEPROM memory with 256 x 16 organization.
• Microwire serial interface operating at a 2 MHz clock frequency.
• 2.5V to 5.5V supply voltage range and -40°C to 105°C ambient operating temperature.
• 5ms word/page write cycle time for stored data updates.
• Automotive-grade device with AEC-Q100 qualification.
• 8-TSSOP-B surface-mount package with 4.40mm width.

Applications

• Storing configuration parameters and calibration constants in automotive electronic control modules.
• Storing small device identifiers, serial numbers, or factory settings in embedded sensor assemblies.
• Preserving nonvolatile operating parameters in compact embedded control boards and measurement modules.
• Storing small data records across power cycles in battery-powered or intermittently powered equipment.

Design & Procurement Notes

When using the BR93A66RFVT-WME2, account for the Microwire interface timing at 2 MHz and the 5ms word/page write cycle when defining firmware write sequences, busy-wait behavior, or polling logic. The 2.5V to 5.5V supply range supports common low-voltage embedded rails, while the -40°C to 105°C ambient rating and AEC-Q100 automotive qualification make the part relevant for vehicle electronics and other temperature-sensitive assemblies. The 8-TSSOP-B surface-mount package with 4.40mm body width should be considered for footprint, stencil, and automated assembly constraints. Because the memory size is 4Kbit organized as 256 x 16, data structures should be planned around the available word capacity rather than assuming a larger EEPROM array.