R7FA6M4AF2CBQ#BC0
MCU:RA
Quick Answer: The R7FA6M4AF2CBQ#BC0 from Renesas Electronics Corporation is a 32-bit microcontroller built around an ARM Cortex-M33 core operating at 200 MHz.
- Manufacturer
- Renesas Electronics Corporation
- Product Category
- Microcontrollers - MCU
- Package
- 64-LFBGA
- Stock
- 3,016 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Renesas Electronics Corporation |
|---|---|
| Product Category | Microcontrollers - MCU |
| Connectivity | CANbus, EBI/EMI, I2C, LINbus, QSPI, SCI, SPI, SSI, UART/USART, USB |
| Core Processor | ARM® Cortex®-M33 |
| Core Size | 32-Bit Single-Core |
| Data Converters | A/D 11x12b SAR; D/A 2x12b |
| EEPROM Size | 8K x 8 |
| Mounting Type | Surface Mount |
| Number of I/O | 45 |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Oscillator Type | External, Internal |
| Package | Tray |
| Peripherals | Capacitive Touch, Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT |
| Product status | Active |
| Program Memory Size | 768KB (768K x 8) |
| Program Memory Type | Flash |
| RAM Size | 256K x 8 |
| Series | RA6M4 |
| Speed | 200MHz |
| Supplier Device Package | 64-LFBGA (6x6) |
| Voltage - Supply (Vcc/Vdd) | 2.7V ~ 3.6V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for R7FA6M4AF2CBQ#BC0.
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Detailed Description for R7FA6M4AF2CBQ#BC0
Product Overview
The R7FA6M4AF2CBQ#BC0 from Renesas Electronics Corporation is a 32-bit microcontroller built around an ARM Cortex-M33 core operating at 200 MHz. It provides 768 KB of FLASH program memory, 256 KB of RAM, and 8 KB of EEPROM, along with 45 I/O pins. The device supports communication interfaces including CANbus, LINbus, USB, I2C, SPI, QSPI, SSI, SCI, UART/USART, and EBI/EMI. It is supplied in a 64-LFBGA (6x6) surface-mount package and operates from a 2.7 V to 3.6 V supply over a -40°C to 85°C (TA) temperature range.
Key Features
- ARM Cortex-M33 32-bit core with 200 MHz operating speed
- 768 KB FLASH program memory, 256 KB RAM, and 8 KB EEPROM
- 45 I/O pins and 64-LFBGA (6x6) surface-mount package
- Communication interfaces include CANbus, LINbus, USB, I2C, SPI, QSPI, SSI, SCI, UART/USART, and EBI/EMI
- On-chip peripherals include capacitive touch, AES, RSA, SHA, DMA, PWM, LVD, POR, WDT, and temperature sensor
- Analog resources: 11 12-bit SAR ADC and 2 12-bit DAC
- 2.7 V to 3.6 V supply range and -40°C to 85°C (TA) operating temperature
- Oscillator options include external and internal sources
Applications
- Embedded control systems that require capacitive touch user interface functionality
- Secure data processing applications using AES, RSA, and SHA on-chip crypto
- Mixed-signal control tasks using 12-bit SAR ADC, 12-bit DAC, and PWM resources
- Networked embedded devices using CANbus, LINbus, USB, or serial interfaces
Design & Procurement Notes
Design considerations should account for the 64-LFBGA (6x6) surface-mount package, 45 I/O pins, and the 2.7 V to 3.6 V supply range. The -40°C to 85°C (TA) operating temperature should be included in thermal and power-margin planning. The 768 KB FLASH, 256 KB RAM, and 8 KB EEPROM can be allocated across firmware, runtime data, and nonvolatile parameter storage. Available external and internal oscillator options allow board-level clock architecture choices. The interface set, including CANbus, LINbus, USB, I2C, SPI, QSPI, SSI, SCI, UART/USART, and EBI/EMI, supports multiple communication topologies, while the 11 12-bit SAR ADC, 2 12-bit DAC, and PWM resources are relevant for mixed-signal control designs.
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