R7FA6M4AD2CBM#BC0
MCU RA6 ARM CM33 200MHZ 512K/256
Quick Answer: The R7FA6M4AD2CBM#BC0 is a Renesas Electronics Corporation RA6M4-series microcontroller built around a 32-bit ARM Cortex-M33 core operating at 200MHz.
- Manufacturer
- Renesas Electronics Corporation
- Product Category
- Microcontrollers - MCU
- Package
- 144-LFBGA
- Stock
- 2,080 pcs
- Availability
- Current quantity subject to confirmation.
Product Attributes
| Manufacturer | Renesas Electronics Corporation |
|---|---|
| Product Category | Microcontrollers - MCU |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD, QSPI, SCI, SPI, SSI, UART/USART, USB |
| Core Processor | ARM® Cortex®-M33 |
| Core Size | 32-Bit Single-Core |
| Data Converters | A/D 22x12b SAR; D/A 2x12b |
| EEPROM Size | 8K x 8 |
| Mounting Type | Surface Mount |
| Number of I/O | 109 |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Oscillator Type | Internal |
| Package | Tray |
| Peripherals | Capacitive Touch, Crypto - AES, DMA, LVD, POR, PWM, RSA, SHA, Temp Sensor, WDT |
| Product status | Active |
| Program Memory Size | 512KB (512K x 8) |
| Program Memory Type | Flash |
| RAM Size | 256K x 8 |
| Series | RA6M4 |
| Speed | 200MHz |
| Supplier Device Package | 144-LFBGA (7x7) |
| Voltage - Supply (Vcc/Vdd) | 2.7V ~ 3.6V |
| Datasheet | View Datasheet PDF |
Procurement Snapshot
Key supply and purchasing information for R7FA6M4AD2CBM#BC0.
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Detailed Description for R7FA6M4AD2CBM#BC0
Product Overview
The R7FA6M4AD2CBM#BC0 is a Renesas Electronics Corporation RA6M4-series microcontroller built around a 32-bit ARM Cortex-M33 core operating at 200MHz. It provides 512KB FLASH program memory, 256K x 8 RAM, 8K x 8 EEPROM, and 109 I/O in a 144-LFBGA (7x7) surface-mount package. The device supports a 2.7V to 3.6V supply range and an ambient operating temperature range of -40°C to 85°C, for embedded control systems that require high-speed processing, multiple communication interfaces, and mixed-signal peripherals.
Key Features
- 32-bit ARM Cortex-M33 core with 200MHz operating speed and internal oscillator.
- 512KB (512K x 8) FLASH program memory, 256K x 8 RAM, and 8K x 8 EEPROM.
- 109 I/O with capacitive touch, PWM, DMA, watchdog timer, low-voltage detect, power-on reset, and temperature sensor.
- Communication interfaces include Ethernet, USB, CANbus, SPI, QSPI, SSI, SCI, I2C, UART/USART, EBI/EMI, and MMC/SD.
- Mixed-signal resources include 22 12-bit SAR ADC channels and two 12-bit DACs.
- Security peripherals include AES, RSA, and SHA crypto functions.
Applications
- Embedded control systems using Ethernet or USB connectivity for network or host communication.
- Capacitive touch input subsystems using serial buses and I/O for user interaction.
- Data-acquisition and actuator-control subsystems using 12-bit ADC and DAC resources, PWM, DMA, and multiple communication interfaces.
- Secure embedded processing applications that use AES, RSA, and SHA peripherals for cryptographic operations.
- Sensor and motor-control systems that combine temperature sensing, low-voltage monitoring, watchdog timing, and high-speed Cortex-M33 processing.
Design & Procurement Notes
For system design, map the 109 I/O and communication interfaces to the board architecture early, and account for the 144-LFBGA (7x7) surface-mount package in the layout. The 2.7V to 3.6V supply range and -40°C to 85°C ambient operating range should be considered during power and thermal planning. Memory allocation should account for 512KB FLASH, 256K x 8 RAM, and 8K x 8 EEPROM. Analog and control design can use the 22 12-bit SAR ADC channels, two 12-bit DACs, PWM, DMA, capacitive touch, temperature sensor, WDT, LVD, and POR. The internal oscillator provides an internal clock source, while Ethernet, USB, CANbus, SPI, QSPI, SSI, SCI, I2C, UART/USART, EBI/EMI, and MMC/SD interfaces provide multiple data paths. The exact part number should be selected when these resources and package dimensions match the target design.
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